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Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device

A manufacturing method and technology of conductive film, which are used in conductive pattern formation, discharge tube/lamp manufacturing, electric solid device, etc., can solve problems such as disconnection, short circuit, liquid retention, etc., and achieve simplified process, less waste, and easy control. Effect

Inactive Publication Date: 2003-12-03
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, there is a problem that it is difficult to widen the width of the film pattern in the technique of disposing the liquid material in the form of droplets on the substrate.
That is, if the volume of one droplet is increased for the purpose of widening the film pattern, or the amount of the entire liquid material placed on the substrate is increased, the shape of the edge of the film pattern will be uneven, causing a decrease in its performance. , or liquid retention (swelling) occurs, which becomes the cause of failures such as disconnection or short circuit

Method used

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  • Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device
  • Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device
  • Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device

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Embodiment Construction

[0046] Hereinafter, as an example of an embodiment of the present invention, a method of forming conductive film wiring on a substrate will be described. The wiring forming method of this embodiment is to arrange a liquid material for wiring of a conductive film on a substrate, and to form a pattern of a conductive film for wiring on the substrate, including a surface treatment process, a material arrangement process, and a heat treatment / light treatment process, etc. . In addition, in disposing the liquid material, a droplet discharge device is used, and a liquid discharge method in which a liquid material is discharged as droplets from a nozzle of a discharge head, a so-called inkjet method, is employed. Here, the discharge method of the droplet discharge device may be a piezoelectric discharge method in which a liquid material (fluid) is discharged by changing the volume of a piezoelectric element, or the like.

[0047] As the substrate for conductive film wiring, various ...

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Abstract

A method and an apparatus for fabricating a pattern which makes it possible to obtain a wide pattern having edges of a preferable shape. The apparatus for fabricating a pattern ejects a liquid material as liquid droplets from an ejecting section, and dispose the liquid droplets on a substrate in a line-shaped pattern. A plurality of line-shaped patterns are formed on the substrate by disposing a plurality of liquid droplets on the substrate in the line-shaped patterns, and then another set of liquid droplets are disposed between the line-shaped patterns so as to integrate the line-shaped patterns with each other.

Description

technical field [0001] The present invention relates to a method and device for forming a pattern on a substrate, in particular to a technology for forming a pattern by spraying a liquid material on a substrate in the form of a droplet through a droplet ejection device. Background technique [0002] As a technique for forming a pattern on a substrate, there is known a method of forming a film of a patterning liquid material on a substrate using a coating technique such as spin coating, and then forming the film into a desired film pattern by photolithography. [0003] In contrast to this, a technique of disposing a liquid material at a desired position on a substrate to directly form a film pattern on the substrate has also been proposed. In this technique, the above-mentioned process related to photolithography can be omitted or simplified. [0004] As a technique for arranging a liquid material at a desired position on a substrate, there is a method of discharging the liq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/10B05D1/26B05D7/00B41J2/07B41J3/407B41J11/00B41J29/00G02F1/13G09F9/00H01L21/00H01L21/288H01L21/3205H01L21/48H01L21/768H01L51/40H01L51/50H05K3/12
CPCB41J3/407H01L2924/0002H01L21/67138H01L51/0004B41M3/16H01J2217/49207H01J2209/012H01L21/6715H01L21/288B41M3/001H01L21/76838H05K3/125H01L21/4867B41J11/008H10K71/13H01L2924/00B41J29/00
Inventor 长谷井宏宣
Owner SEIKO EPSON CORP
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