Method and device for treating base bored

Abstract

The invention provides a device which, when a treatment containing fine particles of ices is supplied to a surface of a board to process the board, can perform a uniform processing without causing a processing unevenness, and does not damage a film formed on the board. The device comprises a roller conveyer for supporting a board W in an inclined attitude to convey it horizontally, a nozzle 12 for supplying the treatment containing fine particles of ices to the main surface of the board, and a planar brush 14 which reciprocates and moves in contact with or in close proximity to the main surface of the board to stir the treatment containing fine particles of ices on the main surface of the board.

Description

technical field [0001] The present invention relates to supplying semiconductor wafers, glass substrates for liquid crystal display (LCD), glass substrates for plasma displays (PDP), printed circuit boards, electronic device substrates, etc. A substrate processing method for cleaning a substrate with a processing solution containing ice particles, and a substrate processing apparatus for performing the method. Background technique [0002] For example, cleaning of substrates in flat panel display (FPD) manufacturing equipment such as LCDs and PDPs is to remove organic contamination by ultraviolet (UV) irradiation with excimer lasers → to remove contaminants larger than 1 μm by cleaning with a roller brush → It is carried out in a series of steps of removing the chemical solution after chemical solution cleaning by displacement cleaning → precise cleaning by two-fluid cleaning → final processing cleaning by final water washing. In addition, in recent years, such a cleaning m...

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Problems solved by technology

However, although it is tiny ice particles, it is extremely difficult to uniformly disperse the liquid containing solids over a wide range of the substrate surface. Therefore, when the ice slurry is sprayed from the nozzle under pressure, according to The position on the surface of the substrate is different, and the energy of the ice slurry hitting the surface of the substrate is also uneven.

Especially when the size of the substrate is increased as in recent years, in order to spread the ice slurry over a wider area of ​​the substrate surface, it is necessary to increase the ejection pressure of the ice slurry from the nozzle, so that the ice slurry is ejected from the nozzle and evenly dispersed on the substrate It is more difficult on the surface, and the unevenness of energy when the ice slurry hits the surface of the substrate is aggravated, and as a result, there are problems such as uneven cleaning and uneven treatment.

[0004] In addition, for example, in the manufacture of LCDs, the metal film for liquid crystal graphics is formed of a physically soft metal material such as aluminum (Al) + molybdenum (Mo). Due to the difference in collision energy between ice particles and the substrate surface, Even, there is a problem that the metal film part is damaged

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