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Integrated circuit plug socket having signal switching device and electron element testing method

A technology for switching devices and electronic components, which is applied to measuring devices, parts of electrical measuring instruments, measuring electricity, etc., can solve the problems of cost, multi-cost, and inconvenience in use

Active Publication Date: 2006-03-29
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, another shortcoming of the originally designed signal conversion device is that when other types of electronic components need to be tested, such as: metal oxide image sensor (CMOS image sensor), charge coupled device (Charge Coupled Device; CCD), electronic The surface of the component is usually equipped with a photosensitive layer to receive light, and a terminal is arranged on the other surface to contact the outside world
If the originally designed signal conversion device is used, the light source (light source) must be erected above the test machine pick-and-place device (handler) for testing, so the test machine pick-and-place device must be aimed at the structure, circuit, etc. Make a major modification, or repurchase another form of light source to be tested by the pick-and-place device of the test machine put in from above, which will cost more and be inconvenient to use

Method used

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  • Integrated circuit plug socket having signal switching device and electron element testing method
  • Integrated circuit plug socket having signal switching device and electron element testing method
  • Integrated circuit plug socket having signal switching device and electron element testing method

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Embodiment Construction

[0044] Some embodiments of the present invention will be described in detail as follows. However, in addition to the following descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited by the embodiments, and the scope of the patents that follow shall prevail. Furthermore, in order to provide a clearer description and a better understanding of the present invention, the various parts in the drawings are not drawn according to their relative sizes, some dimensions have been exaggerated compared with other relevant dimensions; irrelevant details are not fully drawn out, in order to simplify the drawings.

[0045] Such as Figure 3A As shown, it is a three-dimensional assembly diagram of an integrated circuit socket device with a signal transfer device according to a specific embodiment of the present invention. The integrated circuit socket includes a test head device (testhead jig) 301, a base...

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Abstract

The present invention relates to an integrated circuit socket with signal transfer device and electronic element testing method. It is used in an electronic element tester table. Said signal transfer device can be used as interface for making signal transmission between guide needle terminal of base and guide needle terminal of contact pressure block. Said invention also provides the concrete steps of its electronic element testing method.

Description

technical field [0001] The present invention relates to a modular integrated circuit socket (socket), in particular to a modular integrated circuit socket with a signal changeover kit and a testing method for electronic components. Background technique [0002] Electronic components usually need to be tested after the manufacturing is completed. The main purpose is to detect the defects that occur in the manufacturing process of electronic components and find out the cause of the defects. Only in this way can the product yield be improved and effective data can be established for engineering analysis. , and to determine whether electronic components are capable of functioning as intended. Generally, the testing requirements of electronic component products can be divided into two stages: circuit probe (also called wafer sort) and final test (also called package test). Chip testing is usually performed in the form of wafers, mainly in the hope of distinguishing good and bad ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/02G01R31/01
Inventor 林源记黎孟达
Owner KING YUAN ELECTRONICS
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