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Contacting of an electrode with a substance in vacuum
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An electrode and vacuum technology, applied in the direction of vacuum evaporation plating, circuits, electrical components, etc., to achieve the effect of simple method and reduced machine downtime
Inactive Publication Date: 2006-05-31
BEKAERT ADVANCED COATINGS
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However, figure-of-eight test blocks are not always available and are not always possible for all materials due to many reasons such as brittleness, thermal conductivity, material cost, production process....
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[0048] FIG. 1A is a cross-sectional view of a rotating cylindrical target 10 rotating about a stationary magnet assembly 12 . The magnet assembly generates a magnetic field 13 .
[0049] FIG. 1B is an upper view of target 10 . The combined effect of the electric and magnetic forces creates so-called particle tracks 14 on the surface of the target 10 . Particle tracks 14 are regions where target material is sputtered.
[0050] The particle tracks 14 define three different regions on the target 10 .
[0051] The first kind of region forms the main part and is called the erosion region 16 and corresponds to the straight part of the particle track 14 . Within the eroded region 16 the consumption of target material during sputtering is substantially the same.
[0052] A second type of region can be found at the ends, referred to as the end region 18 . In the end region 18 no (or very little) target material is sputtered off, in other words no target material is consumed in the...
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Abstract
A method of improving a sputter deposition process is provided. The method comprises the steps of: a) providing a vacuum; b) providing an electrode (10, 34, 34', 44, 44') in the provided vacuum; c) providing a substrate in said vacuum, said substrate being in contact with said vacuum. The electrodes (10, 34, 34', 44, 44') are not in contact, thereby providing means (22, 22', 24, 24', 26, 26', 28, 28', 30, 36, 36', 48, 48'). The device moves relative to the electrode and makes contact with the electrode in the contact area. The device removes solid material from the electrode or applies solid material to the electrode. The method is implemented by means of simple mechanisms. No complex electronics or complex control algorithms are required. The method is carried out in a vacuum, ie without breaking the vacuum, so machine downtime is reduced.
Description
technical field [0001] The present invention relates to a method of improving a sputter deposition process, such as enhancing a sputtering process by magnetic forces. The term "improved" refers to improved long-term plasma process stability, or improved spray uniformity, or reduced machine downtime during sputter deposition. Background technique [0002] arcing problem [0003] In a magnetron sputter deposition process (magnetism to enhance sputtering), a row of magnets arranged in the shape of a closed loop is mounted behind the target. A magnetic field in the shape of a closed loop is thus formed in front of the target and defines the sputtering zone. This magnetic field generates electrons from a discharge that is trapped in the magnetic field and moves in a spiral shape, which results in a more intense ionization (plasma) and a higher sputtering velocity compared to diode sputtering. A rotating cylindrical magnetron uses a cylindrical cathode as a target. In this con...
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