Semiconductor light emitting device and surface light emitting device
A technology for light-emitting devices and semiconductors, applied in semiconductor devices, electric solid-state devices, instruments, etc., can solve the problems of increasing the size of the light opening, and it is not easy to introduce light, and achieve the effect of saving energy.
Inactive Publication Date: 2006-08-30
KK TOSHIBA
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Problems solved by technology
[0008] However, when covering even the top of the LED chip with a hemispherical reflector, the size of the opening for taking out the light increases, making it difficult to efficiently introduce light from the side of the thin light guide plate.
In addition, the light emitted from the LED chip in the lateral direction may not be efficiently introduced into the light guide plate, which also has room for improvement.
Method used
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Embodiment Construction
[0043] Embodiments of the present invention will be described in detail below with reference to the drawings.
[0044] figure 1 It is a perspective view showing the internal structure of the semiconductor light emitting device of the first embodiment of the present invention.
[0045] also, figure 2 is a horizontal sectional view including an LED chip.
[0046]The LED chip 10 is bonded to the upper surface 90 of the first support 80 on which the conductive portion is provided. As will be described later, the LED chip 10 is flipped (flip chip), or electrical connection is ensured by a wire not shown in the figure. The LED chip 10 has a structure in which semiconductor layers including a light emitting layer are stacked. In addition, the luminescent layer is provided parallel to the upper surface 90 of the first support 80 . Moreover, the "parallel" here is not limited to the mathematically strict parallel, but includes the range that can be called "parallel" in the indust...
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A semiconductor light emitting device may include a first supporting member having a main surface; a semiconductor light emitting element having a light emitting layer and provided on the main surface of the first supporting member, the light emitting layer being substantially parallel to the main surface of the first supporting member; and a second supporting member provided on the main surface of the first supporting member, the second supporting member having a reflective surface and a front opening, the reflective surface being configured to reflect light emitted from the semiconductor light emitting element. A sealing resin is provided in a space surrounded by the first supporting member and the second supporting member and configured to seal the semiconductor light emitting element.
Description
technical field [0001] The present invention relates to a semiconductor light-emitting device and a surface-emitting device, and relates to a surface-emitting device that can be used, for example, as a backlight of a liquid crystal display device, a key button lighting source, or a planar lighting device, and a side-emitting semiconductor light-emitting device suitable for the surface-emitting device. . Background technique [0002] In recent years, the demand for televisions and microcomputers using liquid crystal display devices has been increasing, and the demand for larger and higher precision semiconductor light-emitting devices has also increased. In order to meet these requirements, a high-power semiconductor light emitting device that can be used as a backlight for a liquid crystal display device is indispensable. On the other hand, in liquid crystal display devices and key lighting devices for portable devices, it is necessary to reduce the size of the devices, and...
Claims
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IPC IPC(8): H01L33/00H01L33/08H01L33/10H01L33/32H01L33/54H01L33/56H01L33/60H01L33/62
CPCH01L33/54G02F1/133603H01L33/20H01L33/60H01L2924/0002H01L2924/00
Inventor 小野玲司
Owner KK TOSHIBA