Mechanism for producing end edge guide angle of golden finger on circuit board

A gold finger and circuit board technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of cutting out, uneven length of gold finger surface, and flat pressing

Inactive Publication Date: 2006-10-18
TRIPOD WUXI ELECTRONICS
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] But the interface is only conveyed by the upper and lower conveyor belts. When the interface is subjected to a resistance, the interface will be deflected, so that the cutter cannot cut the correct lead angle on the interface, and then the metal of the interface will be cut. Finger surfaces of varying lengths, such as figure 1 As shown, furthermore, the interface cannot be pressed flat by the upper and lower conveyor belts, making the interface uneven,

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mechanism for producing end edge guide angle of golden finger on circuit board
  • Mechanism for producing end edge guide angle of golden finger on circuit board
  • Mechanism for producing end edge guide angle of golden finger on circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] like figure 2 , 3 , 4, the present invention is a mechanism for making the edge chamfering of the golden fingers on the circuit board, the mechanism is provided with a machine 1, the machine 1 is provided with a movable on the machine 1 Platform 2, a circuit board 3 can be fixed on one side of the platform 2, the machine 1 is provided with a fixture 4 above the platform 2 that can move on the machine 1, the fixture 4 is provided with several openings 42 , the platform 2 and the fixture 4 can be flatly attached to the two sides of the circuit board 3 respectively, and the openings 42 can just correspond to the gold fingers 32 set on the circuit board 3, so that the circuit can be eliminated. The tolerance of the board 3 enables the circuit board 3 to have better flatness at the gold fingers 32. The machine 1 is provided with a tool 5 that can move on the machine 1 adjacent to the fixture 4. When the tool 5 moves to the opening 42, the tool 5 and the processing surface...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A mechanism used for preparing guide angle of end edge on gold finger at circuit board consists of a frame, a tool being set on frame and being set with a numbers of openings, a platform being set on frame near a side of tool and being set with a circuit board and a driver to move platform to tool to let said openings correspond to gold finger on circuit board, a cutter being set on frame near to another side of tool and being used to cut tail end of gold finger at corresponding locations of said openings for cutting out a vertical slope guide angle at tail end of gold finger.

Description

technical field [0001] The invention relates to a mechanism for making the edge chamfering of gold fingers on a circuit board, in particular to a mechanism that can eliminate the tolerance of a circuit board, so that the end edges of the gold fingers on the circuit board can be cut into neat vertical The mechanism of the inclined chamfer in the direction of the direction. Background technique [0002] Generally, after the circuit is printed on the existing circuit board, it will be cut at the appropriate position of the circuit board according to the factory requirements of the product. The circuit board will have burrs at the cut position, which will cause the circuit board to short-circuit, etc. Failure, causing the circuit board to be damaged and unusable, especially after the circuit board is cut at the position with gold fingers, a small piece of conductive wire will remain at the end of these gold fingers, and these conductive wires may overlap to the phase. The adjac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/22H05K3/00
Inventor 陈书华
Owner TRIPOD WUXI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap