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Systems and methods for wiring circuit components

A technology for components, error correction circuits, applied to printed circuit components, circuit layout on insulating boards, circuit layout on support structures, etc., and can solve problems such as unfavorable size reduction

Inactive Publication Date: 2006-11-01
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is not conducive to the desired size reduction

Method used

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  • Systems and methods for wiring circuit components
  • Systems and methods for wiring circuit components
  • Systems and methods for wiring circuit components

Examples

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Embodiment Construction

[0021] One or more embodiments of the invention are described below. It should be noted that these and any other examples described below are exemplary for purposes of explanation and not limitation of the invention.

[0022] In a broad sense, the present invention includes systems and methods for configuring parallel wires to reduce capacitance variations between the wires and thereby reduce the skew of signals on different wires and the time required for signals to travel through the wires.

[0023] In one embodiment, multiple first components, such as buffers or latches, are coupled with second components, such as encoders or error correction logic. The first component is physically configured as a linear array. A second component is positioned at the end of the linear array. Each of the first components is coupled to the second component by a wire having a vertical portion extending perpendicular to the direction of the linear array and a parallel portion extending paral...

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Abstract

Systems and methods for arranging parallel wires to reduce the capacitance variations. In one embodiment, multiple first components arranged as a linear array are coupled to a second component at the end of this linear array by corresponding signal wires. Each signal wire has a perpendicular portion extending perpendicular to the direction of the linear array, and a parallel portion which runs parallel to the direction of the linear array. The parallel portions are staggered so that longer ones of the parallel portions are adjacent to the shorter ones of the parallel portions, instead of simply being arranged from longest to shortest. In one embodiment, the longer half of the parallel portions decrease in length across the series of parallel portions, while the shorter half of the parallel portions increase in length. In another embodiment, successively longer / shorter parallel portions alternate sides of the series.

Description

technical field [0001] The present invention relates generally to electronic circuits, and more particularly to systems and methods for laying out wiring between a first set of circuit components and a second component. Background technique [0002] As electronic technology advances, there is a consistent need for improved electronic devices. In addition to the need for new features in these devices, there is also a desire to make these devices smaller and faster. In order to make electronic devices smaller and faster, it is generally necessary to make the components forming the devices physically smaller. However, reducing the size of these components can cause problems that prevent the device from operating more quickly, or even cause the device to fail. [0003] As the size of electronic components decreases, the size and spacing (pitch) of the wires connecting these components also decrease. As the spacing of wires in a circuit decreases, the coupling capacitance of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11G06F17/50H05K7/06
CPCG06F30/39
Inventor 牧野英一
Owner KK TOSHIBA
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