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Element mounting device

A technology for installing devices and components, applied in electrical components, electrical components, etc., can solve problems such as non-uniformity, and achieve the effect of stable component supply and reliable adsorption

Active Publication Date: 2006-12-20
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the controlled devices have different X, Y, and Z axes, it is difficult to align the position of the component supply device according to the movement of the component mounting device

Method used

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  • Element mounting device
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Examples

Experimental program
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Embodiment Construction

[0024] Hereinafter, the present invention will be specifically described with reference to the drawings.

[0025] (Example)

[0026] exist figure 1 In FIG. 2 , a component mounting device 10 and an external wafer component supply device 30 that supplies wafer components to the component mounting device are shown. The component mounting device 10 is provided with a suction head 11 which can move in the X-axis direction along an X-axis guide rail 15 by an X-axis motor (not shown). The X-axis guide rail 15 is combined with the screw shafts 14, 14', and the Y-axis motors 17, 17' are used to rotate the screw shafts, so that the X-axis guide rail 15 moves in the Y-axis direction along the Y-axis guide rails 16, 16'.

[0027] use figure 2 The symbol 41 in (A) represents the X-axis moving unit such as the X-axis motor and the X-axis guide rail 15, and the symbol 42 represents the Y-axis motor 17, 17', the screw shaft 14, 14', and the Y-axis guide rail 16, 16'. Wait for the Y axi...

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PUM

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Abstract

Component mounting device. Provides a component mounting device that can match the movement amount of the suction head and the head of the supply device, so that the components supplied from the component supply device can be sucked satisfactorily. The suction head (11) is moved to the indicated position, and the wafer component supplied from the component supply device (30) to the indicated position is sucked in synchronization with the jacking action of the supply device head (32) moved to the indicated position. The identification camera (12) installed on the suction head is moved to the indicated position, and the actual position of the supply device head is detected based on the image of the supply device head captured there. When picking up parts, the movement amount of the supply head or suction nozzle to the indicated position is corrected based on the detected actual position of the supply head, so that the positions of the suction nozzle and the supply head match. In this structure, the offset between the coordinate system of the component mounting device and the coordinate system of the component supply device can be corrected, and the indicated position of the suction head and the position indicated by the main body of the component mounting device to the head of the supply device can be matched, thereby realizing stable component supply. .

Description

technical field [0001] The present invention relates to a component mounting device which absorbs an electronic component supplied from a component supply device such as a wafer supply device and mounts it on a circuit board. Background technique [0002] Conventionally, a component mounting device sucks an electronic component (hereinafter simply referred to as a component) supplied from a component supply device by using a suction nozzle of a suction head, and mounts the sucked component on a predetermined position of a conveyed circuit board. Here, the component supply device includes a tray supply device that supplies a tray accommodating a plurality of components, or a wafer supply device that supplies a wafer sheet on which a plurality of components are pasted, in addition to a supply device such as a feeder. [0003] As a parts supply unit, when using a tray supply unit, such as Image 6 As shown in (A), the tray 1 moves from the tray supply device to the component su...

Claims

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Application Information

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IPC IPC(8): H05K13/04
Inventor 岩嵜望
Owner JUKI CORP
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