Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit substrate

A technology of circuit substrates and pad electrodes, applied in the direction of circuits, printed circuits, printed circuits, etc., can solve problems such as disappearance

Active Publication Date: 2007-01-10
OMRON AUTOMOTIVE ELECTRONICS CO LTD
View PDF2 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, there is a problem that the ends of the bonding region 31A and the drain pad electrode 22 are covered with aggregated solder, and the place where the air bubbles are concentrated at the portion of the resin 24 disappears.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit substrate
  • Circuit substrate
  • Circuit substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Next, the circuit substrate according to the embodiment of the present invention will be described in detail.

[0043] figure 1 It means to install such as Figure 6A diagram of the portion of MOSFET 2 shown. The same figure (A) is a front view of the circuit board seen from above, and the same figure (B) is a sectional view of the X-X plane shown in (A). As shown in the figure, in this circuit board 1 , land 11A, land 11B, resist 13A, and resist 13B are patterned, and solder paste 12A and solder paste 12B are printed on land 11A and land 11B, respectively.

[0044] The land 11A is thinly formed in a substantially rectangular parallelepiped shape on the circuit board, and its pattern is formed so that its upper surface is as Figure 6 The bottom surfaces of drain pad electrodes 22 are shown overlapping. The land 11B is thinly formed in a substantially rectangular parallelepiped shape at a plurality of places (two places in the figure) on the circuit board, and is pat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit substrate on which bubbles generated between a pad electrode and a land can be eliminated is disclosed. Resists (13A,13B) are provided at any one of ends of a land (11A) on a circuit substrate. Solder paste (12A) is printed on the land (11A), and an electronic component (MOSFET or the like) is placed and heated on the same. When the solder paste (12A) is melted, an electrode of the electronic component comes into contact with the resists (13A, 13B) on the circuit substrate. A gap is created by the resists (13A, 13B) between the land (11A) and the electrode of the electronic component. Since the melted solder paste (12A) does not wet the resists (13A, 13B), bubbles generated in the solder escape to the end of the land (11A) through the gap.

Description

technical field [0001] The present invention relates to a circuit board to which electronic components are connected, and more particularly to a circuit board with improved connectivity between electrodes. Background technique [0002] Generally, electronic components are mounted by soldering to electrodes formed on the surface of a circuit board. [0003] Figure 6 A MOSFET is shown as an example of an electronic component. This MOSFET is a power MOSFET mounted on a circuit board through which a large current (for example, 100A) flows, and heat is dissipated via the mounted circuit board. The same figure (A) is the plan view of the MOSFET seen from above, the same figure (B) is the cross-sectional view of the X-X plane shown in the same figure (A), the same figure (C) is the plan view seen from the bottom, the same figure (D) is a sectional view of the X-X plane shown in (C) of the same figure. As shown in Figures (A), (B), (C) and (D), the MOSFET 2 consists of a semicon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K1/02H05K1/18
CPCH01L2924/0002H05K2201/099H05K2201/09381H05K2201/10969H05K2203/1178H05K3/341H05K2201/10166H05K2201/09909H05K1/111H05K2201/2036H05K3/3452Y02P70/50H01L2924/00H05K1/18
Inventor 日笠浩一住本义行吉冈大辅
Owner OMRON AUTOMOTIVE ELECTRONICS CO LTD