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Integral liquid-cooled radiator

一种液冷散热、整合式的技术,应用在冷却/通风/加热改造、仪器的冷却、间接换热器等方向,能够解决管件褶弯阻塞、很难满足散热需求、散热装置占用空间大等问题

Inactive Publication Date: 2007-02-14
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the conventional technology is a forced air-cooled cooling device with an aluminum extruded heat sink and a fan stacked on the central processing unit, which is difficult to meet the cooling needs of future high-frequency and high-speed electronic components and product development.
Although the heat dissipation efficiency of the conventional liquid-cooled heat dissipation system is better than that of the forced air-cooled heat dissipation device, the four basic components (pump, heat absorbing plate, liquid storage tank and radiator) forming the system are independent and must be The pipes are connected one by one, so that the entire cooling device takes up a lot of space, and it is difficult to configure it according to the narrow space of the product. In order to avoid pipe bending and blocking when installing in a narrow space, it is often necessary to form hard pipes into complex 3D shapes and increase the process. Due to the large number of pipe fittings and joints, not only the assembly is complicated, time-consuming and labor-intensive, but also because the piping consumes a certain proportion of the head of the pump, the heat dissipation performance is reduced, and the coolant leakage and reliability are increased due to the large number of joints. The risk of reduction, and because the installation and disassembly of the computer system requires each part to be handled separately, not only the operation is cumbersome but also time-consuming and labor-intensive and increases the cost. The above shortcomings are not conducive to cost reduction, heat dissipation performance improvement, reliability improvement, and space Utilization, disassembly, and mass production process, therefore, it is necessary to improve the current liquid cooling system

Method used

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  • Integral liquid-cooled radiator
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  • Integral liquid-cooled radiator

Examples

Experimental program
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Embodiment Construction

[0011] Please refer to Figure 1 to Figure 3 , the present embodiment includes a base 10 formed by the pump 15 and the heat-absorbing chamber 12 being located in a hollow formed part accommodating the pump 15 and the heat-absorbing chamber 12, and a radiator 21 located above the base 10 The first and second liquid storage tanks 22, 23 are integrated with the heat sink 20, which is directly combined with the radiator 20. Since it does not have any piping, it is an integrated liquid cooling heat dissipation device with a modular design.

[0012] The base 10 is provided with an accommodating chamber 11 and a heat-absorbing chamber 12 disposed on one side of the accommodating chamber 11. A first confluence groove 141 and a second confluence groove 142 are respectively provided on the two sides of the base 10, and the accommodating Between the chamber 11, the heat-absorbing chamber 12 and the two confluence tanks, a connection channel 101 is respectively provided as a passage for c...

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PUM

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Abstract

This invention provides an integrated liquid cooling device, including a pump, a heat absorbing room, a radiator and a container. The pump and the heat absorbing room are located in an empty shaped component to form the support base. The radiator and the container compose a heat dissipation body. Then the support base and heat dissipation body integrate to be the liquid cooling device without any other tubes.

Description

【Technical field】 [0001] The present invention relates to a heat dissipation device. Through the modular design of parts, the required integrated liquid cooling heat dissipation device can be combined according to the actual space. 【Background technique】 [0002] With the rapid development of the electronic information industry, high-tech electronic products are developing towards thinner, smaller, multi-functional, and faster calculations. This not only increases the heat dissipation load of the system, but also increases the operating frequency and speed of electronic components. The heat released is also getting higher and higher, which seriously threatens the operation performance and stability of electronic components, and even burns these expensive electronic components due to high temperature; based on the quality of the cooling device, it will directly affect the life and operation quality of electronic components. It is necessary to effectively and quickly dissipate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/36G12B15/02
CPCF28D1/05366H01L23/473H01L2924/0002H01L2924/00
Inventor 刘泰健杨志豪童兆年侯春树
Owner FU ZHUN PRECISION IND SHENZHEN