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Test system for electric components

A technology for testing systems and electronic components, which is used in semiconductor/solid-state device testing/measurement, parts of electrical measuring instruments, measuring electricity, etc.

Inactive Publication Date: 2007-02-21
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, if the traditional testing machine (handler) 100 takes 5 seconds to pick and place an integrated circuit component each time, and the test of each integrated circuit component takes less than 30 seconds (for example, 10-15 seconds), the integrated circuit component test The chances of having to stop and wait after finishing will become very high

Method used

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  • Test system for electric components
  • Test system for electric components
  • Test system for electric components

Examples

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Embodiment Construction

[0051] figure 2 A top plan view of an integrated circuit tester (handler) 10 according to an embodiment of the present invention is shown. Although this embodiment takes the packaged integrated circuit testing machine as an example, the present invention can also be applied to the pre-packaged circuit chip (chip). In addition, the present invention is not limited to (digital or analog) integrated circuits, but can be widely applied to various electronic components and devices.

[0052] An input tray (input tray) 16 is provided near the front end of the integrated circuit testing machine 10 to store the integrated circuit components to be tested; usually, the input tray 16 is composed of a plurality of stacked (only visible in the top view) to the top one). In addition, a plurality of output trays / bins 15 are arranged near the front end of the integrated circuit testing machine 10 to store the tested integrated circuit components; these tested integrated circuit components w...

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Abstract

A test system of electronic element comprises multiple test regions as each said region being set with specific pick / place unit, multiple shuttle unit being set between test region and material supplying / receiving plate, I / O region pick / place unit being set between shuttle unit and material supplying / receiving plate and being used to pick up or place down element to be tested or element having been tested.

Description

technical field [0001] The present invention relates to a test system for electronic components; in particular, it relates to a test system for an integrated circuit (IC), which has a plurality of transfer devices (shuttle) and a plurality of dedicated pick & place devices. Background technique [0002] After the integrated circuit (IC) is packaged, the final test (final test) will be carried out, and the classification (bin) will be made according to the test results. The test machine is a complex and expensive equipment; in order to reduce the test cost or increase the test capacity, one of the solutions is to make full use of the test machine to avoid idle (idle), so as to increase the number of integrated circuits that can be tested per unit time . [0003] figure 1 A top plan view of a conventional test handler 100 is shown. Near the front end of the traditional test machine 100, there is an input tray 104 for storing the integrated circuit components to be tested, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/02G01R31/00H01L21/66
Inventor 谢志宏
Owner KING YUAN ELECTRONICS