Highly effective low energy-consumption thermoelectric components
A technology of thermoelectric components and thermoelectric elements, applied in lighting and heating equipment, machines that use electric/magnetic effects, and machine operation methods, can solve the problems of high cost, low cooling and heating efficiency of semiconductor refrigeration chips, and difficult manufacturing processes And other problems, to achieve the effect of increasing the current, good heat transfer effect, and reducing the difficulty of assembly process
Inactive Publication Date: 2007-07-04
曹知光 +1
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Problems solved by technology
[0006] The technical problem to be solved by the present invention is to solve the problems of low cooling and heating efficiency, high cost, difficult manufacturing process and difficult practical application of the original semiconductor refrigeration chip, and provide a method that reduces raw material costs and manufacturing costs, greatly improves Cooling and heating efficiency and heat conduction efficiency, simple production equipment process, high-efficiency high-efficiency and low-consumption thermoelectric components
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[0051] Referring to the accompanying drawings, the high-efficiency and low-consumption thermoelectric assembly of the present invention consists of a P-type semiconductor thermoelectric element 1, an N-type semiconductor thermoelectric element 2, an upper flow guide 3, a lower flow guide 4, an upper insulating and heat-conducting layer 5, a lower insulating and heat-conducting Layer 6 and the elastic electrical and thermal insulation material filled in the remaining space between the upper and lower electrical and thermal insulation layers. One side is in close contact with the insulating and heat-conducting layer, and is connected and fixed. The P-type semiconductor thermoelectric element 1 and the N-type semiconductor thermoelectric element 2 of the present invention are sheet-type, and the ratio of the cross-sectional area to the thickness is greater than 3, while the ratio of the traditional semiconductor thermoelectric element is less than 2. The upper and lower flow guide...
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The invention relates to a thermoelectric component with high efficiency and low consumption. The P-type semiconductor thermoelectric component and the N-type semiconductor thermoelectric component are thin. The proportion of section area and thickness is more than three. Up-and-down guide parts are thin grass plate. The area of guide pare is more than four times of the section area of semiconductor thermoelectric component. In electricity insulation and heat conduction layer the electricity insulation and heat conduction film or glue takes the place of conventional ceramic plate. In the invention the consumption of semiconductor material is decreased greatly and the heat efficiency is improved by more than two times. The demand of workpiece flat degree by manufacturing process is decreased greatly. The chip is installed easily and the installing efficiency is improved by more than one hundred times. The efficiency of electricity insulation and heat conduction film and glue is high. By said technological characteristics the cost for the thermoelectric component with high efficiency and low consumption is decreased greatly and is only 20% of original technology. The technological performance is improved greatly.
Description
technical field [0001] The invention relates to the technical field of refrigeration and heating, in particular to a high-efficiency and low-consumption thermoelectric assembly applying the principle of thermoelectric refrigeration. Background technique [0002] The principle of semiconductor refrigeration chips comes from the principle of thermoelectric refrigeration, which is also called thermoelectric refrigeration. Materials with thermoelectric energy conversion properties have a cooling function when passing direct current, so they are called thermoelectric refrigeration. Since the semiconductor materials represented by Bi, Te, etc. have strong thermoelectric energy conversion characteristics, its application can really make thermoelectric refrigeration practical, so it is also called semiconductor refrigeration. The origin of the name of thermoelectric refrigeration is that after people discovered the thermoelectromotive force of the material, they discovered its oppo...
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IPC IPC(8): F25B21/02
Inventor 曹知光
Owner 曹知光