High density packaging for multi-disk systems

Inactive Publication Date: 2002-12-26
LEE WHAY S +4
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One problem facing many office computing environments is how to physically arrange and store office computing equipment in a limited amount of space.
Conventional server systems are often packaged in tower type chassis that are often not very space efficient.
Such chassis are typically not stackable and may require a large amount of clearance for fan airflow, etc.
However, an office may not be

Method used

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  • High density packaging for multi-disk systems
  • High density packaging for multi-disk systems
  • High density packaging for multi-disk systems

Examples

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Embodiment Construction

[0039] Conventional storage systems are typically designed to allow for replacement or hot swapping of most essential components, such as disk drives, fans, power supplies, etc. In contrast, FIG. 1 illustrates a storage system 200 assembled as a field replaceable unit, according to one embodiment. The entire system 200 may be a single field replaceable unit (FRU). Storage system 200 may include multiple individual disk drives to provide a large storage capacity which is implemented as a single field replaceable unit. Since there are no or a reduced number of field replaceable or hot swappable internal parts, storage system 200 may have a storage density that is not possible with storage systems that support field or hot replacement of components, such as disk drives.

[0040] Storage system 200 includes a drive array 202. Drive array 202 may include multiple hard disk drives. Each hard disk drive is configured within system 202 so as not to be individually replaceable in the field. Thu...

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Abstract

A substrate for packaging a storage or server system may include one or more sections of the substrate configured to hold a two-dimensional array of disk drives. Another section of this substrate may be configured to hold circuitry for accessing the array of disk drives. This circuitry may include one or more processors. The substrate also includes a first plurality of ribs positioned in the first access of the substrate. The first plurality of ribs separate the sections from one another. The section configured to hold the control circuitry may also be configured to hold one or more power supplies for supplying power to the array of disk drives and control circuitry. This section, as well as other sections, may be divided in two by one or more additional ribs in a transverse direction. The substrate may be configured to be mounted in a cage or rack and may include an edge connector at one edge of the substrate to provide electrical connectivity to a back plane in the cage or rack. A lateral protrusion may extend along each parallel edge of the substrate for mounting the substrate in the cage or rack by sliding the substrate into the cage or rack.

Description

[0001] 1. Field of the Invention[0002] This invention relates to the packaging of storage and / or server equipment, and more particularly a low profile tray for multi-disk storage or server systems and an enclosure for such trays.[0003] 2. Description of the Related Art[0004] One problem facing many office computing environments is how to physically arrange and store office computing equipment in a limited amount of space. Typically, an office may have a central computing room in which most of the office server systems are located. Naturally, it is desirable for such computer rooms to require as little real estate as possible. Conventional server systems are often packaged in tower type chassis that are often not very space efficient. Such chassis are typically not stackable and may require a large amount of clearance for fan airflow, etc. Some computer environments employ racks to mount computer systems in a more space efficient manner. A standard-industrial 19 inch rack is often us...

Claims

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Application Information

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IPC IPC(8): G11B33/12
CPCG11B33/125
Inventor LEE, WHAY S.TALAGALA, NISHAWU, CHIA Y.CHONG, FAY JR.RETTBERG, RANDALL D.
Owner LEE WHAY S
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