Modular Surface Mount Manifold Assemblies

Abstract

Abstract of the DisclosureA modular manifold system is provided for interconnecting fluid components of a fluid system in a reduced area. The system is comprised of a one or more bridge fittings having an internal fluid passageway which has an inlet end in fluid communication with an outlet port of a first fluid component, and an outlet end in fluid communication with an inlet port of a second fluid component. The bridge fittings may additionally comprise two or more ports, which one of said ports may be in fluid communication with a manifold on another substrate level. The bridge fittings may be mounted within a channel of a backing plate for structural support or in channel blocks of varying sizes. An optional locator plate may be utilized which is mounted over the ends of the bridge fittings in order to align the inlet and outlet ports of the fluid components with the inlet and outlet ends of the bridge fittings. The bridge fittings may also be mounted to the locator plate in multiple directions forming multiple flow paths. Additionally, the bridge fittings may be stacked to form multiple layers.

Description

Detailed Description of the InventionCross Reference To Related Applications[0001] This application is a continuation of United States Patent Application Serial No. 09 / 544,020 for MODULAR SURFACE MOUNT MANIFOLD ASSEMBLIES filed April 6, 2000, which is a continuation of International Patent Application No. PCT / US99 / 10980 filed on May 18, 1999 and which designated the U.S., and which was a continuation in part of International Patent Application No. PCT / US99 / 04972 filed March 5, 1999. This application further claims the benefit of U.S. Provisional Application No. 60 / 085,817 filed on May 18, 1998 and U.S. Provisional Application No. 60 / 102,277 filed on September 29, 1998.Field of the Invention[0002] The invention relates in general to manifolds for fluid systems, and more particularly, the invention relates to a modular gas distribution system for use in high purity fluid systems and corrosive fluid systems such as gas systems used, for example, to manufacture semiconductor wafers.Bac...

AI Technical Summary

Benefits of technology

[0006] Thus it is desired that a modular manifold design be provided which eliminates the seals between modular mating blocks, dramatically reduces the amount of expensive material utilized, and results in a simpler and less expensive system to manufacture while providing a reduced system footprint or envelope which meets or surpasses the performance, integrity and reliability of existing systems.

Problems solved by technology

These connections may be undesirable in some applications because they add additional time and cost for welding operations, unnecessary space between components and make it difficult to replace a component located between other components.

Further, these systems are typically custom designed and manufactured which make the manufacturing costs and procurement of replacement parts quite expensive.

One disadvantage to these type of prior art modular systems is that the entire modular block is made of high purity metal.

Further, these block components also have higher manufacturing costs due to the complexity of machining multiple passageways of a single block as well as a higher risk of expensive scrap being formed due to the manufacturing complexity.

In addition, the mating blocks require the use of mating seals therebetween, which require additional manufacturing time, and further require proper installation and makeup torque of the fastener members in order to ensure a leak-tight seal.

Images