Method and system for predicting process performance using material processing tool and sensor data

Abstract

A material processing system including a process tool and a process performance prediction system. The performance prediction system includes sensors coupled to the tool to measure tool data and a controller coupled to the sensors to receive tool data, where the controller is configured to predict the process performance for the tool using the tool data. A method for detecting a fault in a material processing system using a process performance prediction model is also provided. The method includes preparing the tool, initiating a process in the tool, and recording tool data to form to a tool data matrix. The method also includes performing a matrix multiplication of the tool data matrix and a correlation matrix to form predicted process performance data, where the correlation matrix includes the performance prediction model, comparing the predicted data with target data, and determining a fault condition of the processing system from the comparing step.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The present application claims priority to previously filed U.S. Application Ser. No. 60 / 391,965, filed on Jun. 28, 2002. This application is related to U.S. Application Ser. No. 60 / 391,966, filed on Jun. 28, 2002. The entire contents of these applications are incorporated herein by reference.FIELD OF THE INVENTION [0002] The present invention relates to material processing and more particularly to a process performance prediction system and method thereof for predicting process performance including process rate and process uniformity. BACKGROUND OF THE INVENTION [0003] One area of material processing in the semiconductor industry which presents formidable challenges is, for example, the manufacture of integrated circuits (ICs). Demands for increasing the speed of ICs in general, and memory devices in particular, force semiconductor manufacturers to make devices smaller and smaller on the substrate surface. Moreover, in order to reduce...

AI Technical Summary

Problems solved by technology

One area of material processing in the semiconductor industry which presents formidable challenges is, for example, the manufacture of integrated circuits (ICs).

However, the etch stop layer complicates the process integration, increases manufacturing cost and decreases device performance.

Since, for example, the etch tool is subject to equipment disturbance, the etch rate can change significantly over maintenance cycles.

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