Method for fabricating a color filter

Abstract

A method for fabricating a color filter (CF) is provided. The method includes steps of providing a substrate and forming a dielectric layer thereon, performing a first lithography process with a first photoresist on the dielectric layer to form a plurality of first pixels, performing a second lithography process with a second photoresist on the dielectric layer to form a plurality of second pixels, wherein the second pixels overlap the first pixels, which the second pixels are next to, performing a third lithography process with a third photoresist on the dielectric layer such that the dielectric layer is covered with the third photoresist, and calendering a cylinder on the third photoresist to form a plurality of third pixels and to form a flat surface by the first, the second and the third pixels.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a method for fabricating a color filter (CF), and more specifically, to a method for improving the efficiency of the polishing process of a color filter. BACKGROUND OF THE INVENTION [0002] With the proceeding of modern manufacturing technologies, the liquid crystal display (LCD) has been in widespread use. The working principles of the LCD are using an electric field to control the arrangement of liquid crystal molecules and displaying brilliant or dark images by the beams of the backlight which have passed the liquid crystal molecules or not. The performance of a liquid crystal display extremely depends on the properties of the optical components implemented therein, especially the quality of the color filter (CF) configured therein. [0003] Please refer to FIG. 1, which shows a fabrication process for a color filter according to the prior art. As shown in FIG. 1, a transparent and polished oxidated layer 102 is formed o...

AI Technical Summary

Problems solved by technology

First, during the manufacturing process of the pixels, the pixels of different colors would easily overlap or cover with each other because of the misalignment.

The gaps between different pixels lead to the interference of light.

To prevent this defect, the process of the green pixels 1032 must have two lithography processes, which increases the cost substantially.

Second, the different coating thickness of the blue photoresist, green photoresist and red photoresist result in a surface with a high roughness.

However, this improved method still fails to control the thickness of different pixels well.

Moreover, although one lithography process of the green pixels 1032 manufacturing process is omitted, the cost down is still limited since an additional etching process is needed.

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