Modular heel assembly for high heel shoes

a module and high heel technology, applied in the direction of heels, wear-resisting attachments, fastenings, etc., can solve the problems of high heel shoes that are difficult to wear, the level surface is prone to perils for the wearer, and the wearer is often fatigued and uncomfortable, so as to increase the area of the shoe

a module and high heel technology, applied in the direction of heels, wear-resisting attachments, fastenings, etc., can solve the problems of high heel shoes that are difficult to wear, the level surface is prone to perils for the wearer, and the wearer is often fatigued and uncomfortable, so as to increase the area of the shoe

US20060196082A1Inactive Publication Date: 2006-09-07ROBBINS DAVID B
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  • Modular heel assembly for high heel shoes
  • Modular heel assembly for high heel shoes
  • Modular heel assembly for high heel shoes

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example 1

Stiletto Shoe with Assembly for Receiving Modular Wedge Apparatus

[0041] In this embodiment of the invention, grooves have been manufactured into the body of the shoe that is designed to accept protrusions of the modular wedge. FIG. 5 presents a schematic cross-sectional view of the bottom portion of the shoe (10) which contains a groove (14) in the posterior section of the body of the shoe under the ball of the foot. This groove may be in the outsole, or may start in and pass through the outsole and end within the midsole of the shoe. The modular attachment (12) includes a tongue-like protrusion (15), manufactured contiguous with the modular heel that fits into the groove (14). This groove adaptation is also depicted in FIG. 6, which presents a view from below of the shoe and modular heel assembly. FIG. 6 also shows that the shoe contains a groove at the top of the back of the heel (16), adapted to receive a posterior edge (17) of the modular attachment, depicted on FIG. 7. A close...

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Abstract

The present invention relates to a removable modular heel assembly that is attached to a high heel shoe, which shoe may be adapted to accept the assembly, and which assembly is designed to increase the surface area of the heel or shoe to enhance stability, comfort, and / or balance for the wearer.

Description

RELATED PATENT APPLICATIONS [0001] This patent application is related to, and claims the benefit under 35 U.S.C. § 119(e) of, U.S. provisional patent application Ser. No. 60 / 651,492, converted from U.S. patent application Ser. No. 11 / 068,233 filed 1 Mar. 2005, and U.S. provisional patent application Serial No. 60 / 714,051 filed 2 Sep. 2005, which are incorporated herein by reference in their entirety.FIELD OF THE INVENTION [0002] The present invention relates to modular heel assemblies for high heel shoes and to high heel shoes. More particularly, the invention relates, for example, to a removable modular heel assembly that fits against a high heel shoe that may, for example, be adapted to accept the assembly, and which may be further designed to increase the surface area of the heel and enhance stability for the wearer. BACKGROUND OF THE INVENTION [0003] Many versions of high heel shoes, for example stiletto heels, have small surface areas where the heel portion of the high heel sho...

Claims

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Application Information

Patent Timeline
07 Sep 2006
Publication
US20060196082A1
IPC
A43C13/00; A43B13/28; A43B21/36
CPC
A43B3/24; A43B3/246; A43B21/42
Inventors
ROBBINS, DAVID B.