System and method for thermal management using distributed synthetic jet actuators

Abstract

One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60), though not required, typically comprises a housing (47) defining an internal chamber (45) and having an orifice (46) in a wall (44) of the housing (47). The synthetic jet actuator (60) typically also comprises a flexible diaphragm (42) forming a portion of the housing (47). The tube (61) of this exemplary embodiment typically comprises a proximal end (64) and a distal end (65), the proximal end (64) being positioned adjacent to the synthetic jet actuator (60). In this embodiment, operation of the synthetic jet actuator (60) causes a synthetic jet stream (52) to form at the distal end (65) of the tube (61).

Description

TECHNICAL FIELD [0001] The present invention is generally related to thermal management technology and, more particularly, is related to a system and method for cooling heat-producing bodies or components using distributed synthetic jet actuators. BACKGROUND OF THE INVENTION [0002] Cooling of heat-producing bodies is a concern in many different technologies. Particularly in microprocessors, the rise in heat dissipation levels accompanied by a shrinking thermal budget has resulted in the need for new cooling solutions beyond conventional thermal management techniques. Moreover, there is a greatly increased demand for effective thermal management strategies to be used within small handheld devices, such as portable digital assistants (PDA's), mobile phones, portable CD players, and similar consumer products. Indeed, thermal management is a major challenge in the design and packaging of state-of-the-art integrated circuits in single-chip and multi-chip modules. [0003] Traditionally, th...

AI Technical Summary

Problems solved by technology

Indeed, thermal management is a major challenge in the design and packaging of state-of-the-art integrated circuits in single-chip and multi-chip modules.

Fans are capable of supplying ample volume flow rate, but there are several distinct disadvantages to using a fan.

Fans are relatively inefficient in terms of the heat removed for a given volume flow rate.

In addition, the use of fans to globally or locally cool a heated environment often results in electromagnetic interference and noise generated by the magnetic-based fan motor.

For this or other reasons, fans may be hindered by long-term reliability.

Mobile applications introduce the added complication of space constraints that might be difficult to achieve with fans, while at the same time increased thermal management requirements have necessitated larger fans driving higher flow rates.

Since the power dissipation requirements have necessitated placing fans directly on the heat sink in some instances, the associated noise levels due to the flow-structure interaction have become an additional concern.

While these approaches are common, they offer certain drawbacks that will be exacerbated as new products that produce even more heat are developed.

The difficulty with the heat spreading strategy is simply that it is often ineffective at removing adequate quantities of heat.

Additionally, the heat dissipated may result in raising the temperature of the casing of the handheld device, which is not desirable from a consumer use ergonomic standpoint.

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