Inkjet nozzle with ink feed channels etched from back of wafer
Inactive Publication Date: 2007-11-22
MEMJET TECH LTD +1
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0017] Etching the ink feed channels from the back surface of the wafer removes the need for ink feed channels beside the chambers. This provides more room for the power and print data connections to each nozzle along the front surface of the wafer. Individual ink feed channels for each nozzle eliminates fluidic cross talk between adjacent nozzles. An ink feed channel that supplies several nozzles from the side of each chamber needs to incorporate special features such as pinch points to deal with fluidic cross talk. However, a back etched ink feed channel can supply several nozzles without fluidic cross talk (e.g. IJ37 discussed below).
Problems solved by technology
Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
One complication with high nozzle density on a printhead is the ink, power and print data supply to each and every nozzle.
Method used
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Basic Fabrication Sequence
[1439] Two wafers are required: a wafer upon which the active circuitry and nozzles are fabricated (the print head wafer) and a further wafer in which the ink channels are fabricated. This is the ink channel wafer. One form of construction of printhead wafer will now be discussed with reference to FIG. 449 which illustrates an exploded perspective view of a single inkjet nozzle constructed in accordance with a preferred embodiment. [1440] 1) Starting with a single crystal silicon wafer, which has a buried epitaxial layer 2316 of silicon which is heavily doped with boron. The boron should be doped to preferably 1020 atoms per cm3 of boron or more, and be approximately 3 micron thick The lightly doped silicon epitaxial layer 2315 on top of the boron doped layer should be approximately 8 micron thick, and be doped in a manner suitable for the active semiconductor device technology chosen. This is the printhead wafer. The wafer diameter should preferably be t...
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An inkjet printhead with a wafer substrate and an array of ink ejection nozzles formed on the front side by lithographic etching and deposition techniques; and, a plurality elongate ink feed channels etched from the back side for supplying ink to the nozzles. Etching the ink feed channels from the back surface of the wafer removes the need for ink feed channels beside the chambers. This provides more room for the power and print data connections to each nozzle along the front surface of the wafer. Individual ink feed channels for each nozzle eliminates fluidic cross talk between adjacent nozzles. An ink feed channel that supplies several nozzles from the side of each chamber needs to incorporate special features such as pinch points to deal with fluidic cross talk. However, a back etched ink feed channel can supply several nozzles without fluidic cross talk.
Description
CROSS REFERENCES TO RELATED APPLICATIONS [0001] The following Australian provisional patent applications are hereby incorporated by reference. For the purposes of location and identification, US patents / patent applications identified by their US patent / patent application serial numbers are listed alongside the Australian applications from which the US patents / patent applications claim the right of priority. US PATENT / PATENTCROSS-REFERENCEDAPPLICATION (CLAIMINGAUSTRALIAN PRO-RIGHT OF PRIORITYVISIONAL PATENTFROM AUSTRALIAN PRO-DOCKETAPPLICATION NO.VISIONAL APPLICATION)NO.PO799109 / 113,060ART01PO85056,476,863ART02PO798809 / 113,073ART03PO93956,322,181ART04PO80176,597,817ART06PO80146,227,648ART07PO802509 / 112,750ART08PO80326,690,419ART09PO799909 / 112,743ART10PO799809 / 112,742ART11PO803109 / 112,741ART12PO80306,196,541ART13PO79976,195,150ART15PO79796,362,868ART16PO801509 / 112,738ART17PO797809 / 113,067ART18PO79826,431,669ART19PO79896,362,869ART20PO80196,472,052ART21PO79806,356,715ART22PO801809 / 112...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B41J2/015B41J2/04B41J2/045B41J2/14B41J2/16B41J2/165B41J2/175B41J3/42B41J3/44B41J11/00B41J11/70B41J15/04G01D15/00G06F1/16G06F21/00G06K1/12G06K7/14G06K19/06G06K19/073G07F7/08G07F7/12G11B5/127H04N1/00H04N1/21H04N1/32H04N5/225H04N5/262
CPCB41J2/14314H04N5/2628B41J2/1623B41J2/1626B41J2/1628B41J2/1629B41J2/1631B41J2/1632B41J2/1635B41J2/1637B41J2/1639B41J2/1642B41J2/1643B41J2/1645B41J2/1646B41J2/1648B41J2/16585B41J2/17513B41J2/17596B41J3/445B41J11/0005B41J11/70B41J15/04B41J2002/041B41J2002/14346B41J2002/14435B41J2202/21B42D2035/34G06F21/79G06F21/86G06F2221/2129G06K1/121G06K7/14G06K7/1417G06K19/06037H04N5/225B41J2/14427H04N23/00
Inventor SILVERBROOK, KIA
Owner MEMJET TECH LTD