Laterally Interconnected IC Packages and Methods

Abstract

Semiconductor devices and methods for their assembly are described in which IC packages may be combined in novel configurations. A multi-package semiconductor device system and associated methods for its construction include a plurality of packaged semiconductor devices, each provided with at least one lateral electrical contact. The plurality of packaged semiconductor devices so provided are fixed in a coplanar configuration and have the adjacent lateral contacts coupled for operation in concert.

Description

TECHNICAL FIELD[0001]The invention relates to electronic semiconductor devices and manufacturing. More particularly, the invention relates to microelectronic semiconductor devices and their packages and to methods and systems for implementing assemblies having lateral interconnections among IC packages.BACKGROUND OF THE INVENTION[0002]Semiconductor device assemblies are subject to many competing design goals. It is very often desirable to minimize the size of electronic apparatus. At the same time, the demand for increased features results in an increase in the number of components on a given device. Efforts are continuously underway to design and manufacture devices with reduced area, but attempts to increase density while reducing area must inevitably reach a practical limit.[0003]In lateral multi-device layouts, semiconductor devices are placed on a planar substrate such as a PCB or PWB. Typically, electrical connections are made between each device and the substrate by coupling ...

AI Technical Summary

Benefits of technology

[0006]In carrying out the principles of the present invention, in accordance with preferred embodiments thereof, the invention provides multi-package semiconductor device assemblies having direct lateral electrical connections among adjacent packages for direct communication, reducing their reliance on a common substrate interface.

[0010]The invention has numerous advantages including but not limited to providing methods and devices offering one or more of the following; smaller package footprints, higher pin count packages for given footprints, faster data throughput, and reduced costs. These and other features, advantages, and benefits of the present invention can be understood by one of ordinary skill in the arts upon careful consideration of the detailed description of representative embodiments of the invention in connection with the accompanying drawings.

Problems solved by technology

Efforts are continuously underway to design and manufacture devices with reduced area, but attempts to increase density while reducing area must inevitably reach a practical limit.

One notable disadvantage of this type of arrangement is the area required on the substrate.

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