Semiconductor device and method for manufacturing a semiconductor device

Abstract

A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a first location. It further includes a third conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a second location, and a fourth conducting element arranged outside the semiconductor chip. A vertical projection of the fourth conducting element on the chip crosses the first conducting element between the first location and the second location.

Description

[0001]This invention refers to embodiments of semiconductor devices and methods for their production, particularly the electrical connection between a semiconductor chip and its supporting structure.BACKGROUND[0002]In the production of semiconductor devices, small contact elements on the semiconductor chip have to be connected to electrical terminals which provide a contact to the outside world. These connections are generally realized as part of the package or encapsulation of the semiconductor chip, e.g. by providing a metallization layer on a face of the chip which provides conducting elements or lines connecting the contact elements of the chip to contact elements on an outer face of the package, e.g. solder balls. Especially with high pin counts, the problem frequently occurs that the high number of conducting lines in the layer cannot be arranged without crossings between at least some of the lines. In a single metallization layer, a crossing of two lines can not be realized b...

AI Technical Summary

Benefits of technology

The patent text describes a semiconductor device that includes a semiconductor chip with conducting elements and a layer of conducting elements located adjacent to the chip. The chip is connected to the layer of conducting elements through contact elements. The device also includes a fourth conducting element that crosses the first conducting element in a vertical projection. The technical effect of this design is that it allows for more efficient and reliable electrical connection between the chip and the layer of conducting elements. Additionally, the method of manufacturing the device allows for the separation of the chips after the application of a metallization layer, which improves the overall quality of the device.

Problems solved by technology

Especially with high pin counts, the problem frequently occurs that the high number of conducting lines in the layer cannot be arranged without crossings between at least some of the lines.

In a single metallization layer, a crossing of two lines can not be realized because this would cause an electrical shortcut between the lines.

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