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Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier

a carrier and substrate technology, applied in the direction of printed circuit details, printed circuit manufacturing, conductive pattern formation, etc., can solve the problem of increasing manufacturing costs and achieve the effect of easy and expensive production

Inactive Publication Date: 2010-06-17
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0024]Accordingly, the present invention has been made keeping in mind the above problems occurring in the related art, and the present invention provides a carrier used in the manufacture of a substrate, which can be easily and expensively produced, and a method of manufacturing a substrate using the carrier.
[0025]Furthermore, the present invention provides a carrier used in the manufacture of a substrate, which can be efficiently used by employing the carrier as a part of the substrate, and a method of manufacturing a substrate using the carrier.

Problems solved by technology

Additionally, according to the conventional process, since the carrier which is removed after completion of manufacture of a substrate is made of expensive metal, manufacturing costs are increased.

Method used

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  • Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
  • Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
  • Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier

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first embodiment

[0048]FIG. 11 is a cross-sectional view of a carrier used in the manufacture of a substrate according to the present invention, and FIG. 12 is a cross-sectional view showing a process of manufacturing the carrier used in the manufacture of a substrate as shown in FIG. 11. Referring to the drawings, the carrier 100a for manufacture of a substrate and a method of manufacturing the carrier 100a, according to this embodiment are described below.

[0049]As shown in FIG. 11, the carrier 100a according to this embodiment includes a releasing layer 112 on both sides of which are formed insulating layers 114a and 114b and metal layers 116a and 116b.

[0050]In this regard, the insulating layers 114a and 114b function to offer rigidity to the carrier 110a and to serve as solder resist layers in a subsequent process of manufacturing the substrate. For example, the insulating layers 114a and 114b may be made of ABF, prepreg or insulating material containing glass. More specifically, the present inv...

second embodiment

[0054]FIG. 13 is a cross-sectional view of a carrier used in the manufacture of a substrate according to the present invention, and FIG. 14 is a cross-sectional view showing a process of manufacturing the carrier used in the manufacture of a substrate as shown in FIG. 13. Referring to the drawings, the carrier 100b used in the manufacture of a substrate and a method of manufacturing the carrier 100b, according to this embodiment are described below.

[0055]As shown in FIG. 13, the carrier 100b used in the manufacture of a substrate according to this embodiment includes two releasing layers, that is, a first releasing layer 112a and a second releasing layer 112b and a reinforcing layer S disposed between the first and second releasing layers 112a and 112b, unlike the carrier 100a shown in FIG. 11. The remaining components other than these unique components are substantially identical to those of the carrier 100a used in the manufacture of a substrate shown in FIG. 11, and thus the redu...

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Abstract

The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2008-0128642, filed Dec. 17, 2008, entitled “A Carrier member for manufacturing a substrate and a fabricating method of substrate using the same”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier.[0004]2. Description of the Related Art[0005]Generally, a printed circuit board is constructed in a manner such that a board which is composed of various thermosetting synthetic resins is wired at one or both sides thereof with copper foils, IC or electronic devices are arranged and mounted on the board and electrically connected to each other and then the resulting board with the electronic devices mounted thereon is coated with an insulating ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/02H05K3/02
CPCH05K3/4644H05K3/4682H05K2203/0156H05K3/20Y10T29/49155Y10T29/49126H05K3/0097H05K3/0052H05K2203/1536H05K3/00H05K3/46H05K13/02
Inventor KIM, KI HWANAN, JIN YONGKANG, MYUNG SAM
Owner SAMSUNG ELECTRO MECHANICS CO LTD