Heat pipe and method for manufacturing the same

Abstract

A heat pipe includes a metallic pipe, a wick structure and a working fluid. The interior of the metallic pipe has a sealing chamber, and is formed into an evaporating section, an adiabatic section and a condensing section along its lengthwise direction. The wick structure comprises a first wick structure and two elongate second wick structures connected to the first wick structure. The first wick structure is adhered to the inner wall of the evaporating section. The two second wick structures are separated from each other and adhered to the inner walls of the evaporating section, the adiabatic section and the condensing section. A gas channel is formed between the two second wick structures, and has a smooth surface. The working fluid is filled in the sealed chamber. By this arrangement, the space for the gas channel can be enlarged, thereby accelerating the flowing speed of the internal gas and enhancing the heat-conducting efficiency of the heat pipe.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat pipe, and in particular to a heat pie that can be used to dissipate the heat of a heat-generating source of an electronic device and a method for manufacturing the same.[0003]2. Description of Prior Art[0004]With the continuous advancement of the operating speed of the central processing unit (CPU) of a computer, the amount of heat generated by the operation of the computer is increasing to a large extent. The heat-dissipating device comprised of an aluminum-extruded heat sink and a fan has become unable to satisfy the requirements for the heat dissipation of the current central processing unit. Thus, the manufacturers in this field propose novel heat pipes having better heat-dissipating efficiency. Then, this kind of novel heat pipe is combined with a heat sink to solve the problem of heat dissipation at the current stage. However, the design of the internal structure of the heat...

AI Technical Summary

Benefits of technology

[0016]The present invention has advantageous effects as follows. With different particle sizes and pore arrangement of the first and second wick structures, the condensed liquid within the heat pipe can flow back to the evaporating section rapidly, thereby overcoming the dry-out of the heat pipe efficiently. Further, with a flat profile of the heat pipe, it can be widely used in the electronic devices that are made more and more compact. Therefore, such a heat pipe can be used in various fields.

as follows. With different particle sizes and pore arrangement of the first and second wick structures, the condensed liquid within the heat pipe can flow back to the evaporating section rapidly, thereby overcoming the dry-out of the heat pipe efficiently. Further, with a flat profile of the heat pipe, it can be widely used in the electronic devices that are made more and more compact. Therefore, such a heat pipe can be used in various fields.

Problems solved by technology

The heat-dissipating device comprised of an aluminum-extruded heat sink and a fan has become unable to satisfy the requirements for the heat dissipation of the current central processing unit.

However, the design of the internal structure of the heat pipe is dependent on the flowing speed of the gas and fluid within the heat pipe and the usage of space.

Furthermore, the internal surface of the wick structure is of a rugged surface, which may further obstruct the flowing speed of the internal gas.

The above-mentioned problems are the primary factors causing the poor efficiency in dissipating the heat of the heat pipe.

Therefore, it is an important issue to improve the conventional heat pipe.

Images