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Insole Comprising an Electronic Chip

a technology of electronic components and insoles, which is applied in the direction of uppers, bootlegs, apparel, etc., can solve the problems of inability to make electronic components sufficiently flexible, the module inadvertently falls out of the receiving chamber, and the known insoles are only suited to a limited degree, so as to increase the stability and service life, improve the press-through characteristics of the module, and improve the effect of the effect of the modul

Inactive Publication Date: 2011-12-08
CAIROS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention is an insole with an electronic chip embedded in it, where the chip is removably embedded in the insole. The invention aims to improve the wearing comfort of the shoe and prevent the module from falling out. The invention provides an insole with an improved receiving chamber that securely holds the module in place and prevents pressure sensations on the foot. The invention also includes a stiffening element that helps distribute the weight of the person wearing the shoe over the module and the stiffening element. The stiffening element can be designed to stiffen the insole in sections or all around the insole. The invention also includes a module that can be easily removed and re-inserted in the insole."

Problems solved by technology

The known insoles are only suited to a limited degree for sports shoes for lawn sports, particularly football shoes, because on account of the type the shoes have cleats, knobs, or the like, and also a relatively thin sole so that there is only little space for accommodating the module.
So far it has also not been possible to make the electronic components sufficiently flexible, so that during prolonged use of the insole according to the invention the module integrated into the insole does not create a pressure sensation through the insole.
Moreover, there is the risk that the module inadvertently falls out of the receiving chamber.
This prevents objectionable edges that press onto the wearer's foot and might possibly reduce the wearing comfort of the insole.

Method used

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  • Insole Comprising an Electronic Chip
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Experimental program
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Embodiment Construction

[0032]The preferred embodiment of the invention will now be described in detail with reference to FIGS. 1 to 7.

[0033]FIG. 1 is a view on the top side A of an insole 1 according to the invention. The insole 1 according to the invention is specifically configured as an insole 1 for football shoes and is therefore of a particularly small overall height. For the sake of clarity the figure only shows the left insole 1, and only the structure and function of the left insole 1 are described. The right insole has a mirror-inverted structure with respect to the left insole 1. The module 10 comprising the chip 2 can be selectively arranged in the receiving chamber 8 of the left or of the right insole 1. When two identical modules are available, it is also possible to equip both insoles 1 with a corresponding module 10.

[0034]A body of the insole 1 or individual components or layers 6, 7 thereof is / are preferably made by injection (molding), foaming, casting, laminating, punching, or the like, ...

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PUM

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Abstract

The present invention relates to an insole comprising an electronic chip. To impart improved wearing comfort to the wearer of a shoe equipped with the generic insole, it is provided according to the invention that a module encompassing the chip is removably embedded in the insole.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority to European Patent Application No. 10006748.8 filed Jun. 2, 2010, which claims priority to German Patent Application No. 202011005164.1, filed Apr. 12, 2011, which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]The present invention relates to an insole comprising an electronic chip, wherein a module encompassing the chip is removably arranged in the insole.[0003]An insole with a top-sided or bottom-sided receptacle for the module is e.g. known from US 2007 / 0260421 A1. Insoles of such a type are e.g. used in the running shoe sector to collect performance data of the wearer of the running shoes. The receptacle of the insole in US 2007 / 0260421 A1 is open towards one side of the insole (FIGS. 5C, 6C).[0004]The known insoles are only suited to a limited degree for sports shoes for lawn sports, particularly football shoes, because on account of the type the shoes have cleat...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A43B13/38
CPCA43B17/00A43B3/0005A43B3/34
Inventor HOLZER, CHRISTIAN
Owner CAIROS TECH