Less expensive high power plastic surface mount package

Abstract

A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a division of U.S. Ser. No. 12 / 590,377, filed Nov. 6, 2009, now U.S. Pat. No. 8,274,164 to issue Sep. 25, 2012, which claims the benefit of U.S. Ser. No. 61 / 198,478 filed Nov. 6, 2008, entitled “Less Expensive High Power Plastic Surface Mount Package,” the teachings of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention is generally related to semiconductor packages, and more particularly to large area high power dies having thermal cooling.BACKGROUND OF THE INVENTION[0003]Semiconductor packages typically comprise an enclosed die that generates a certain amount of heat during operation. Some semiconductor dies are high power devices that generate a significant amount of heat, such as transient voltage suppressors. Cooling devices are often employed to facilitate the dissipation of thermal heat, such as heatsinks and the like. Typically, the semiconductor die is mechanically and ...

AI Technical Summary

Benefits of technology

The present invention is a high power surface mount package that uses a thick bond line of solder to connect a die to a heatsink and a lead frame. The lead frame has the same coefficient of thermal expansion as the heatsink. This package design can be assembled using standard automated equipment and does not require a weight or clip to force the parts close together. The thermal stresses on each side of the die are effectively balanced to prevent damage to the die over temperature cycles, allowing for a large surface area die to be packaged with conventional and inexpensive materials. The invention is particularly useful for dies that generate a significant amount of heat, such as transient voltage suppressors.

Problems solved by technology

Thus, the materials expand at different rates as a function of temperature during operation which can crack and damage the die over varying operating temperatures.

Images