Sensor assembly for use in medical position and orientation tracking
a technology for positioning and orientation tracking, applied in the field of sensors, can solve the problem that the contact pad is not suitable for receiving a soldered connection
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[0019]As discussed herein, a position and orientation sensor assembly is discussed that is suitable for use in a medical device, implant or instrument. In certain embodiments, the sensor assembly may include a magnetoresistance sensor, such as a two-axis electromagnetic sensor, providing six-degrees of freedom. In implementations where the position and orientation sensor is originally configured for wire bonding to an interposer that is subsequently soldered to a printed circuit board, contact pads on the sensor may be unsuitable for a soldered connection. The position and orientation sensor may, therefore, be modified by the application of various additional metallization layers so that the sensor may be interconnected directly to a substrate using an approach better suited for achieving a small form factor for the finished sensor assembly, such as a flip chip approach. For example, in implementations where the original position and orientation sensor has interconnect pads that are...
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