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In-Shoe Support Device For Heeled Shoes

a technology for supporting devices and heels, which is applied in the direction of shoes, top-pieces, shoes, etc., can solve the problems of uneven distribution of weight and increased and achieve the effects of increasing contact area, uneven weight distribution, and increasing pressure in the forefoo

Inactive Publication Date: 2015-12-10
PAI CHUN SHUN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an in-shoe support device for high-heeled shoes that can evenly distribute weight and reduce pressure on the forefoot. This device can easily be adapted to any style of heeled shoe without needing to modify them. The device can also be placed by the wearer or incorporated into the shoe during manufacturing. This device can increase the contact area of the midfoot and rearfoot, transfer weight from the forefoot to the midfoot and rearfoot, decrease the pressure on the forefoot, decrease the heel wedge angle and increase the wearer's comfort.

Problems solved by technology

In general, high-heeled shoes cause uneven distribution of weight and increased pressure in the forefoot.

Method used

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  • In-Shoe Support Device For Heeled Shoes
  • In-Shoe Support Device For Heeled Shoes
  • In-Shoe Support Device For Heeled Shoes

Examples

Experimental program
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Embodiment Construction

[0031]The purposes, construction, features, functions and advantages of the present invention can be appreciated and understood more thoroughly through the detailed description below and attaching referenced drawings.

[0032]Refer to FIGS. 4A and 4B respectively for a top view of an in-shoe support device 50 for heeled shoes according to an embodiment of the present invention; and a side view of an in-shoe support device 50 for heeled shoes according to an embodiment of the present invention. These two figures are used to describe the thickness distribution of the in-shoe support device 50 for a heeled shoe according to an embodiment of the present invention. The in-shoe support device 50 includes a main body 60. The main body 60 has a first end 62 and a second end 64. The second end 64 is disposed opposite to the first end 62. The length of the main body 60 is defined as a distance between the first end 62 and the second end 64. A maximum thickness H of the main body 60 is disposed i...

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PUM

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Abstract

Disclosed is an in-shoe support device for heeled shoes, comprising: a first end, a second end, a first support portion, a second support portion, and a third support portion. The design of the thickness distribution and its correspondence to the foot position in heeled shoes can alter a curvature of a foot bed of a heeled shoe. As such, it is able to increase the contact areas of midfoot and rearfoot, and provide sufficient support for the midfoot. Also, it can reduce the tendency of a foot to slide forward in the heeled shoe, creating a backward-shifting of a center of gravity, and creating a better weight-bearing environment for the foot.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an in-shoe support device, and in particular to an in-shoe support device for heeled shoes, that could create a better body weight distribution. Herein, the heeled shoe is referred to as a shoe that raises the heel of the wearer's foot higher than the toes. As such, the high heeled shoe is a kind of heeled shoe.[0003]2. The Prior Arts[0004]Usually, wearing heeled shoes could create slender body proportions and add formality to any outfit. However, there is the long-standing problem that wearing heeled shoes could cause discomfort or even more serious sequela to the feet.[0005]Even though academic research indicates that the heel wedge angle of the heeled shoe is related to the problem of uneven distribution of weight, to be more precisely, excess stress on the forefoot, there is no proper device for solving this problem.[0006]At present, a lot of designs are proposed for solving the prob...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A43B21/24
CPCA43B21/24A43B7/141A43B7/142A43B7/143A43B7/30
Inventor PAI, CHUN-SHUN
Owner PAI CHUN SHUN