Method and system for modifying a surface topography

a surface topography and surface technology, applied in the direction of printing, other printing apparatus, electrical components, etc., can solve the problems of general loss of vacuum pressure and increase of nois

Inactive Publication Date: 2017-03-16
HP SCITEX LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach enables quick and cost-effective modification of substrate supports to achieve precise topography, ensuring secure substrate fixation and improved print quality by adapting to different substrate types, even for less precisely manufactured supports, and maintaining a consistent printhead-to-substrate gap.

Problems solved by technology

Furthermore, using substrates smaller than a substrate support creates problems in that when vacuum orifices are not covered by a substrate this results in a general loss of vacuum pressure, may lead to an increase in noise, and may have other undesirable consequences.

Method used

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  • Method and system for modifying a surface topography
  • Method and system for modifying a surface topography
  • Method and system for modifying a surface topography

Examples

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Embodiment Construction

[0022]Referring now to FIG. 1, there shown an illustration of a substrate support 100. The substrate support 100 comprises a top surface 102 into which are incorporated an arrangement of vacuum orifices 104. The vacuum orifices 104 are in fluid communication with a vacuum pump (not shown). The vacuum pump sucks air from each of the vacuum orifices 104 such that a substrate placed on the substrate support 100 is secured to the substrate support 100 by way of the negative air pressure generated beneath the substrate in the region of each vacuum orifice 104.

[0023]The substrate support 100 is a flatbed substrate support, although the principles described herein also apply for drum-shaped and other shaped substrate supports.

[0024]For a given vacuum-based substrate support the number of vacuum orifices, the arrangement of the vacuum orifices, and the characteristics of the vacuum orifices are design considerations made when manufacturing a substrate support based on characteristics of the...

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Abstract

According to one example, there is provided a method or system for modifying the surface topography of a substrate support.

Description

BACKGROUND[0001]In various industries substrates are often required to be supported on substrate supports prior to processing operations being performed on the substrates. Examples of such industries are the printing industry, the semi-conductor manufacturing industry, and other sheet material manufacturing industries.[0002]In the printing industry substrates are generally secured to a substrate support prior to printing being performed on the substrate. In industrial printing systems, substrates are often secured to a substrate support using a vacuum-based substrate support which has an arrangement of vacuum orifices in fluid communication with a vacuum pump.[0003]Vacuum-based substrate supports are generally designed according to the characteristics of the substrates with which they are intended to be. For example, a substrate support intended to secure lightweight flexible substrates may have a small number of vacuum orifices distributed across the substrate support, whereas a su...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): B41J11/00B41J2/01
CPCB41J2/01B41J11/0015B41J3/407B41J11/0085B41J13/226B41J11/00214Y10T428/24802B41J2/07H05K13/0069
InventorDAVIDSON, ALEX
OwnerHP SCITEX LTD