Package-on-package modules, electronic systems including the same, and memory cards including the same

a technology of electronic systems and modules, applied in the field of semiconductor packages, can solve the problems of reducing the thickness affecting the reliability of the pop module,

Inactive Publication Date: 2017-05-25
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design effectively reduces stress on connection members, enhancing the reliability of PoP modules by minimizing thermal expansion-induced warpage and maintaining module stability across temperature variations.

Problems solved by technology

This may lead to a difficulty in reducing a thickness of the PoP modules.
However, such semiconductor packages may readily warp.
As a result, cracks may form at interfaces between the semiconductor packages and the connection members, and the cracks may degrade the reliability of the PoP modules.

Method used

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  • Package-on-package modules, electronic systems including the same, and memory cards including the same
  • Package-on-package modules, electronic systems including the same, and memory cards including the same
  • Package-on-package modules, electronic systems including the same, and memory cards including the same

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Experimental program
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Embodiment Construction

[0028]In a package-on-package (PoP) module including a lower package and an upper package which are electrically coupled to each other, connection members electrically coupling the lower package to the upper package may experience various stresses. One cause of a stress to the connection members is a difference between coefficients of thermal expansion of a substrate and a molding member constituting the upper package. Embodiments of the present disclosure include PoP modules that may reduce a stress applied to the connection members because of a temperature variation even though a coefficient of thermal expansion of the substrate is different from a coefficient of thermal expansion of the molding member. Even though the temperature variation is occurred, the extent of the bending moment by the warpage of the upper package is reduced, thereby reducing the stress applied to the connection members. Thus, the reliability of the PoP modules may be improved.

[0029]FIG. 1 is a cross-sectio...

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Abstract

Package-on-package (PoP) modules are provided. The PoP module includes a lower package and an upper package disposed over the lower package. The lower package includes a lower substrate and a lower chip disposed over a top surface of the lower substrate. The upper package includes an upper substrate, a plurality of upper chips disposed over a top surface of the upper substrate, and an upper molding member disposed over the plurality of upper chips. The upper molding member is divided into at least two parts which are separated from each other by a trench. Related memory cards and related electronic systems are also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application is a continuation of U.S. patent application Ser. No. 14 / 254,768, filed Apr. 16, 2014, which claims priority under 35 U.S.C 119(a) to Korean Application No. 10-2013-0159075, filed on Dec. 19, 2013, in the Korean Intellectual Property Office, which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]Embodiments of the present disclosure relate to semiconductor packages and, more particularly, to package-on-package modules, electronic systems including the same, and memory cards including the same.[0004]2. Related Art[0005]With the development of electronics industry, faster, smaller and high performance electronic components are increasingly in demand. In response, semiconductor package technologies have been continuously developed. For example, a plurality of semiconductor chips may be stacked on a single package substrate to form multi-chip stacked packages, or a plurality of...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L25/10H01L23/31H01L25/065
CPCH01L25/105H01L25/0655H01L2225/1023H01L2225/1058H01L23/3128H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/15311H01L21/56H01L23/562H01L2225/1076H01L2924/15331H01L2924/00014H01L2924/00H01L23/12
InventorJEONG, JUNG TAE
OwnerSK HYNIX INC