Sealing material composition for LED

a technology of sealing material and composition, which is applied in the direction of solid-state devices, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of coloration of sealing materials and brightness reduction, and achieve excellent heat-resistant transparency, excellent adhesion and crack resistance, and low sulfur gas permeability

Inactive Publication Date: 2017-10-26
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0023]A cured product of a sealing material composition for an LED is applied to a device in which an LED element is surrounded by a silver reflector plate, and the device is filled with a sealing material. This scaling material is required to have adhesion and gas permeability. A reduction in the performances is not preferable since a gas containing a sulfur component enters into the device, resulting in corrosion of the silver reflector plate.
[0024]In the present invention, a polysiloxane as an (A) component containing a specific amount of hydrolysis-condensation product of silane having a phenyl group and two hydrolysable groups and a polysiloxane as a (B) component containing a specific amount of hydrolysis-condensation product of silane having a phenyl group and three hydrolysable groups are mixed at a specific ratio. A combination of the specific polysiloxanes, a (C) component, and a (D) component exerts effects.
[0025]Unit structures of Formulae (1-2), (2-1), and (2-2) are derived from a silane having three hydrolysable groups, and have a linear structure or a three-dimensional structure. A Si—OR2 group in Formula (1-2), a Si—OR3 group in Formula (2-1), and a Si—OR4 group in Formula (2-2) form a Si—OH group, a Si—OR group (wherein R is a C1-12 alkyl group), or a siloxane bond of Si—O—Si.
[0026]A sealing material composition for an LED of the present invention is characterized by forming a cured product having excellent heat-resistant transparency, adhesion, and crack resistance, and low sulfur gas permeability. An LED device sealed with the cured product of the sealing material composition for an LED of the present invention has excellent reliability.
[0027]The present invention is a sealing material composition for an LED comprising a polysiloxane containing unit structures of Formula (1-1), (1-2), and (1-3) as an (A) component, a polysiloxane containing unit structures of Formula (2-1), (2-2), and (2-3) as a (B) component, an adhesive as a (C) component, and a condensation catalyst for a silanol group as a (D) component.
[0028]In Formula of the (A) component, R1 is a C1-12 alkyl group or a C6-20 aryl group, R2 is a hydrogen atom, a C1-12 alkyl group, or a Si atom constituting a main chain of the polysiloxane as the (A) component, and the ratio of the number (s) of the unit structure of Formula (1-1), the ratio of the number (m) of the unit structure of Formula (1-2), and the ratio of the number (n) of the unit structure of Formula (1-3) satisfy 0.3≦s≦0.65, 0.25≦m≦0.4, and 0.1≦n≦0.3, respectively, relative to the total number of all the unit structures constituting the polysiloxane as the (A) component of 1.0.

Problems solved by technology

When the cured product is used in a high-brightness LED which exhibits high light intensity and generates a large amount of heat, there are problems such as discoloration of a sealing material due to corrosive gases in an environment and a reduction in brightness due to corrosion of silver which is used as the electrode or with which the substrate is plated.

Method used

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  • Sealing material composition for LED
  • Sealing material composition for LED
  • Sealing material composition for LED

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

[0072]In a reactor, 80.73 g (0.330 mol) of diphenyldimethoxysilane, 30.0 g (0.22 mol) of methyltrimethoxysilane, and 22.06 g (0.184 mol) of dimethyldimetboxysilane were placed, and 0.44 g (7.0 mmol) of acetic acid and 46.30 g (2.569 mol) of water were then placed. The mixture was stirred at room temperature for 1 hour. Subsequently, 119.2 g of toluene and 2.06 g (37.0 mmol) of potassium hydroxide were added, and the mixture was heated and refluxed for 3 hours. The mixture was cooled to room temperature, and 147 g of ethyl acetate solution containing 1.2% by mass acetic acid was added to perform a neutralization reaction. After then, ethyl acetate and water were added, and the mixture was stirred and then left to stand. Water of the lower phase was taken out, and an organic phase of the upper phase was repeatedly washed with water. Water was taken out, and a substance having a low boiling point was then distilled off under reduced pressure by heating from the organic phase, to obtain...

synthesis example 2

[0073]In a reactor, 32.29 g (0.132 mol) of diphenyldimethoxysilane, 8.1 g (0.059 mol) of methyltrimethoxysilane, and 3.44 g (0.029 mol) of dimethyldimethoxysilane were placed, and 0.13 g (2.0 mmol) of acetic acid and 13.89 g (0.771 mol) of water were then placed. The mixture was stirred at room temperature for 1 hour. Subsequently, 43.59 g of toluene and 0.245 g (4.1 mmol) of potassium hydroxide were added, and the mixture was heated and refluxed for 3 hours. The mixture was cooled to room temperature, and 11.02 g of ethyl acetate solution containing 1.2% by mass acetic acid was added to perform a neutralization reaction. After then, ethyl acetate and water were added, and the mixture was stirred and then left to stand. Water of the lower phase was taken out, and an organic phase of the upper phase was repeatedly washed with water. Water was taken out, and a substance having a low boiling point was then distilled off under reduced pressure by heating from the organic phase, to obtai...

synthesis example 3

[0074]In a reactor, 29.90 g (0.122 mol) of diphenyldimethoxysilane, 10.0 g (0.073 mol) of methyltrimethoxysilane, and 5.88 g (0.049 mol) of dimethyldimethoxysilane were placed, and 0.15 g (2.0 mmol) of acetic acid and 15.43 g (0.856 mol) of water were then placed. The mixture was stirred at room temperature for 1 hour. Subsequently, 45.78 g of toluene and 0.275 g (5.0 mmol) of potassium hydroxide were added, and the mixture was heated and refluxed for 3 hours. The mixture was cooled to room temperature, and 12.25 g of ethyl acetate solution containing 1.2% by mass acetic acid was added to perform a neutralization reaction. After then, ethyl acetate and water were added, and the mixture was stirred and then left to stand. Water of the lower phase was taken out, and an organic phase of the upper phase was repeatedly washed with water. Water was taken out, and a substance having a low boiling point was then distilled off under reduced pressure by heating from the organic phase, to obta...

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Abstract

A sealing material composition for LED has excellent heat-resistant transparency, adhesion, and crack resistance, and low sulfur gas permeability. A sealing material composition for LED has the following (A), (B), (C), and (D):
(A): polysiloxane containing units (1-1), (1-2), and (1-3):
wherein R1 is C1-12 alkyl or C6-20 aryl, R2 is hydrogen, C1-12 alkyl, or Si constituting main chain of polysiloxane as (A); (B): polysiloxane containing units (2-1), (2-2), and (2-3):
wherein R3 and R4 are each hydrogen, C1-12 alkyl, or Si constituting main chain of polysiloxane as (B); (C): adhesive; and (D): condensation catalyst for silanol group.

Description

TECHNICAL HELD[0001]The present invention relates to a sealing material composition for an LED, a cured product of the composition which is obtained by curing the composition, and a sealing material composition for an LED containing the sealing material.BACKGROUND ART[0002]Since a silicone composition forms a cured product having excellent weather resistance, heat resistance, hardness, and rubber properties such as extension, the silicone composition is used for protection of an LED element, an electrode, a substrate, and the like, in an LED device. In the LED device, conductive silver or silver-containing alloy is used as the electrode. In order to improve brightness, the substrate may be plated with silver.[0003]In general, the cured product of the silicone composition has high gas permeability. When the cured product is used in a high-brightness LED which exhibits high light intensity and generates a large amount of heat, there are problems such as discoloration of a sealing mate...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08G77/04C08G77/00F21V31/00H01L33/00
CPCC08G77/04C08G77/80H01L33/0045C08G2190/00F21V31/005C08G77/18C08K5/56C08L83/04C08L83/06H01L33/56H01L2924/0002H01L23/29H01L23/31H01L2924/00C08L83/00C08K5/548C08K5/57C08G77/08C08G77/14C08G77/20C08K5/5419
Inventor SHUTO, KEISUKEKATO, TAKUKOBAYASHI, JUNPEISUZUKI, MASAYOSHI
Owner NISSAN CHEM IND LTD
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