Composition for organic electronic element encapsulant, and encapsulant formed by using same

Abstract

A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation application of International Application No. PCT / KR2017 / 004860 filed on May 11, 2017, which claims priority to Korean Patent Application No. 10-2016-0057671 filed on May 11, 2016. The applications are incorporated herein by reference.TECHNICAL FIELD[0002]The present application relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same.BACKGROUND ART[0003]In general, organic electronic devices are devices characterized in that a phenomenon such as light emission or a flow of electricity occurs when charges are injected into an organic layer provided between a positive electrode and a negative electrode, and it is possible to manufacture a device which serves various functions according to the organic material selected.[0004]As a representative example, organic light emitting diodes (OLEDs) have drawn attention as a next generation flat panel display ...

AI Technical Summary

Benefits of technology

[0009]The present application has been made in an effort to provide a composition capable of preparing an encapsulant which may improve a service life of an organic electronic device and effectively block oxygen or moisture, and the like, which are introduced from the outside, and an encapsulant using the same.

[0018]The composition for an encapsulant according to an exemplary embodiment of the present application is characterized in that it is possible to manufacture an encapsulant which may improve a service life of an organic electronic device, and effectively block oxygen and moisture and the like, which are introduced from the outside. Further, a general composition applied as the encapsulant in the related art has a disadvantage in that the composition is bonded to an organic electronic device and then mixed with other materials, thereby losing the characteristics, or a gap between bonded surfaces is not maintained due to uneven pressure applied during the bonding. However, the composition for an encapsulant according to an exemplary embodiment of the present application has characteristics in that the gap may be maintained well after the composition is bonded to an organic electronic device because a material cured by using a curable composition has strength, and thus the gap is not easily changed even though pressure is applied.

Problems solved by technology

These organic electronic devices are very vulnerable to moisture and oxygen and thus have a disadvantage in that light emitting efficiency and a service life are significantly reduced when the devices are exposed to the air or when moisture is introduced into the inside of a panel from the outside.

However, the glass cap has a problem in implementing a large area due to mechanical damage and the like, and the metal cap has a problem in processes due to a difference in thermal expansion coefficients with a substrate.

Further, an adhesive film using the laminating method has problems such as introduction of moisture and oxygen through an interface of the adhesive surface of the film, and the existing processes in which organic materials are deposited under vacuum and inorganic materials are sputtered under vacuum have problems in that productivity is low because inorganic materials need to be deposited in multilayers by a sputtering system under vacuum in order to prevent the introduction of water and oxygen through an interface on the top of the sputtering, and productivity deteriorates and mass production is unavailable because organic materials and inorganic materials need to be formed in multilayers under vacuum.

In addition, a liquid encapsulation method has a disadvantage in that byproducts produced during the curing process or unreacted residue and the like in a curing initiator remain inside a hermetically sealed structure and thus interrupt the driving of an organic electronic device or shorten a service life of the organic electronic device, and the like.

The method in the related art makes it difficult to process the metal cap due to an expansion of a space inside the encapsulation when a panel becomes large, and may cause a problem in that the glass cap is easily broken by external pressure.

Further, a general composition applied as the encapsulant in the related art has a disadvantage in that the composition is bonded to an organic electronic device and then mixed with other materials, thereby losing the characteristics, or a gap between bonded surfaces is not maintained due to uneven pressure applied during the bonding.

However, the composition for an encapsulant according to an exemplary embodiment of the present application has characteristics in that the gap may be maintained well after the composition is bonded to an organic electronic device because a material cured by using a curable composition has strength, and thus the gap is not easily changed even though pressure is applied.

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