Silicone-modified epoxy resin composition and semiconductor device

Abstract

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and / or silicone-modified phenolic resin.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a Divisional of copending application Ser. No. 15 / 971,019 filed on May 4, 2018, which claims priority under 35 U.S.C. § 119(a) on Patent Application Nos. 2017-099972 and 2017-100000 filed in Japan on May 19, 2017 and May 19, 2017, respectively, the entire contents of which are hereby incorporated by reference.TECHNICAL FIELD[0002]This invention relates to a silicone-modified epoxy resin composition having improved tracking resistance, a silicone-modified epoxy resin composition having a reduced modulus and the suppressed risk of cracks and separation while maintaining thermal stability and temperature / humidity resistance, and a semiconductor device encapsulated with a cured product of the resin composition.BACKGROUND ART[0003]The current mainstream of semiconductor devices including diodes, transistors, ICs, and LSIs is of the resin encapsulation type. Epoxy resins have superior moldability, adhesion, electrical propert...

AI Technical Summary

Benefits of technology

[0044]The resin composition in the first embodiment of the invention is advantageous in that using a specific silicone-modified epoxy resin and a specific silicone-modified phenolic resin as curing agent, formation of carbide conductive paths which can cause short-circuiting is suppressed and tracking resistance is enhanced. The resin composition in the second embodiment of the invention is advantageous in that using a specific silicone-modified epoxy resin and a specific phenol compound and / or silicone-modified phenolic resin as curing agent, the modulus is reduced and the risk of cracking or separation is suppressed while maintaining thermal stability and temperature / humidity resistance.

Problems solved by technology

This makes it difficult to secure a space distance and creepage distance sufficient to provide electric insulation therebetween.

Also, while aromatic moiety makes a substantial contribution to the heat resistance of resin compositions, non-aromatic epoxy resins invite a lowering of heat resistance, giving detrimental impact on reliability.

However, when encapsulation is made by coating the thermosetting resin on the entire surface of a thin silicon interposer of 8 to 12 inches, substantial warpage occurs due to the difference in coefficient of thermal expansion between the silicon and the thermosetting resin.

The substantial warpage poses an outstanding technical problem because of prohibited transfer to the subsequent polishing and singulation steps.

Although silicon (Si) has long been used as the semiconductor, the silicon technology approaches its performance limit.

For example, it becomes rather difficult to expect an outstanding performance improvement such as a reduction of the resistance of power MOSFET for the purpose of reducing the power loss during power transformation.

Although the epoxy resin is a thermosetting resin having a good balance of moldability, substrate adhesion and mechanical strength, it undergoes pyrolysis of crosslinking points at temperatures in excess of 200° C. This prohibits the use of epoxy resin as the encapsulant in the high-temperature environment in which operation of SiC and GaN devices is expected.

This composition, however, suffers from poor mass productivity because the reaction of epoxy groups with cyanato groups to form an oxazole ring requires a high temperature / long term heat curing step.

Because of insufficient humidity resistance, the composition has the problem that peeling and cracking occur when it is held in a hot humid environment for a long term.

However, this resin composition has a high modulus and is insufficient in suppressing separation at the interface between a chip-mounted surface of a substrate and the cured product of the resin composition.

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