Method and system of providing artifacts in a cloud computing environment

a cloud computing environment and artifact technology, applied in the field of cloud computing systems, can solve the problems of inconvenient user of the cloud computing platform, time-consuming and cumbersome task of managing artifacts during their lifecycle, etc., and achieve the effect of convenient management, efficient commissioning, monitoring, and maintaining of artifacts

Inactive Publication Date: 2021-03-04
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]Each artifact during its lifecycle may go through different stages such as development, testing, validation, deployment, provisioning, and real-time execution. The artifact may refer to a cloud application, an edge application, code snippet, hardware configuration, digital twin model, application programming interfaces (APIs), simulation model, connectivity solution, firmware, device configuration, security applications, and so on. In certain embodiments, the artifact may provide one or more tenants of a cloud computing system to access one or more cloud services provided by the cloud computing system. For example, the one or more cloud services provide the one or more tenants to efficiently commission, configure, monitor, control, and maintain an industrial plant communicatively connected to the cloud computing system.
[0012]According to an embodiment, the cloud computing system provides a cloud computing platform for developing, testing, validating, deploying, publishing, provisioning, and monitoring said each artifact associated with cloud service delivered by the cloud computing system. Thus, the cloud computing system provides management of artifact during its lifecycle. This is referred to as ‘Artifact Lifecycle Management’. The artifact lifecycle management on the cloud computing platform provides interaction between different stages during lifecycle of the artifact, thereby making management of artifact easy and efficient during its lifecycle.

Problems solved by technology

The currently known cloud computing systems does not provide a cloud computing platform capable of managing artifacts throughout its lifecycle.
This makes managing artifacts during its lifecycle a time consuming and cumbersome task.
The current cloud computing platform does not provide an artifact that may be used in different scenarios, thereby causing inconvenience to the user of the cloud computing platform.

Method used

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  • Method and system of providing artifacts in a cloud computing environment
  • Method and system of providing artifacts in a cloud computing environment
  • Method and system of providing artifacts in a cloud computing environment

Examples

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Embodiment Construction

[0043]Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for the purpose of explanation, numerous specific details are set forth in order to provide thorough understanding of one or more embodiments. It may be evident that such embodiments may be practiced without these specific details.

[0044]Throughout the specification, the terms ‘cloud computing system’ and ‘cloud system’ are used interchangeably. Also, the terms ‘cloud computing platform’ and ‘cloud platform’ are used interchangeably.

[0045]FIG. 1 is a schematic representation of a cloud computing environment 100, according to an embodiment. FIG. 1 depicts the cloud system 102 that is configured to provide cloud services for managing an industrial plant 106 including assets 108A-N. The cloud computing system 102 is connected to assets 108A-N in ...

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Abstract

A method and system for providing artifacts in a cloud computing environment. In an embodiment, a method includes generating an executable file associated with an artifact to be deployed on a cloud computing system. The method includes creating a directory entry associated with the artifact in an artifact repository. The method includes generating an association between the executable file associated with the artifact and the directory entry associated with the artifact. The method includes generating association between a template associated with the artifact and the directory entry associated with the artifact. The method includes generating an artifact package including the executable file and the template associated with the artifact. The method includes publishing the artifact package associated with the artifact in an application marketplace using the directory entry.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This present patent document is a § 371 nationalization of PCT Application Serial Number PCT / EP2019 / 050947 filed Jan. 15, 2019, designating the United States, which is hereby incorporated in its entirety by reference. This patent document also claims the benefit of EP18151637.8 filed on Jan. 15, 2018 and EP19151684.8 filed on Jan. 14, 2019 both of which are also hereby incorporated in their entirety by reference.FIELD[0002]Embodiments relate to a cloud computing system, a method, and a system of providing artifacts in a cloud computing environment.BACKGROUND[0003]With advent of cloud computing technology, a large number of devices (also known as ‘assets’) are connected to a cloud computing system via the Internet. The devices may be remotely located from the cloud computing system. For example, the devices may be equipment, sensors, actuators, robots, machinery in an industrial set-up(s). The devices may also be medical devices and equipm...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G06F9/48G06F9/50
CPCG06F9/485G06F9/5027G06F9/5072H04L41/046H04L41/0806H04L43/50H04L67/1097G06F8/60G06F8/70G06F21/6218H04L9/088H04L9/0894H04L9/3213H04L9/3228H04L63/0807H04L63/10H04L63/104H04L41/0843H04L41/5054H04L41/5077G06F21/335H04L63/08H04L63/102H04L67/1001H04L9/3239H04L9/3247H04L9/3271H04L61/2592G06F8/77G06F11/3608G06F11/3688G06F21/44H04L9/3242
Inventor JIANG, CHUANQI, WEIWAHL, ALEXANDERZHAO, GUANG HUA
Owner SIEMENS AG
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