Method of manufacturing alloy circuit board

Abstract

A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2006-0090719 filed with the Korean Intellectual Property Office on Sep. 19, 2006, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a method of manufacturing an alloy circuit board.[0004]2. Description of the Related Art[0005]These days, there are ongoing advances in inkjet technology, and a wide range of research efforts are focused on methods of using inkjet printing in processes involving color filters, printed circuit boards (PCB's), etc. However, despite the developments in ink in which pure particles are synthesized, such as silver ink and copper ink, etc., it is difficult to synthesize two types of ink, and control is not easy at the particle level.[0006]There is as yet no technology for forming alloy circuits using inkjet technology, but as shown FIG. 1 and FIG. ...

AI Technical Summary

Benefits of technology

[0010]An aspect of the present invention is to provide a method of manufacturing an alloy circuit board, with which a desired alloy circuit can be formed to a predetermined thickness without using alloy ink, and no additional devices are necessary, and with which an alloy circuit can be formed in a short time by an inexpensive process without the use of masks.

Problems solved by technology

However, despite the developments in ink in which pure particles are synthesized, such as silver ink and copper ink, etc., it is difficult to synthesize two types of ink, and control is not easy at the particle level.

However, the above method is for forming thin films in the order of nanometers, and requires additional devices such as the vacuum chamber and plasma generator.

It is an expensive process, and also consumes too much time to be applicable to forming circuits of micrometer-level thickness.

Furthermore, due to the inconvenience in having to prepare additional masks for selective deposition in order to form circuit patterns at particular positions, this method is virtually impossible to apply to forming circuits having a thickness of several micrometers.

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