Cooling fan housing assembly
a cooling fan and housing technology, applied in the direction of electrical apparatus casings/cabinets/drawers, semiconductor/solid-state device details, instruments, etc., can solve the problems of increasing the manufacturing cost of the cooling fan, the cooling fan is subject to deformation or even damage, and the cooling fan is fast and stable, so as to reduce labor and time, the effect of quick and stable assembly
Active Publication Date: 2012-04-03
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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AI Technical Summary
Benefits of technology
This solution simplifies the assembly process, reduces manufacturing costs, and ensures stable operation of the cooling fan, enhancing heat dissipation efficiency while minimizing noise and vibration.
Problems solved by technology
By doing this, the radiating fins of the heat-dissipating unit are subject to deformation or even damage.
The deformed or damaged radiating fins would result in narrowed flow passages and accordingly wind resistance to adversely affect the heat dissipation.
While the thermal module 1 has the cooling fan 11 connected to the heat sink 13 via the mounting rack 12, a lot of labor and time is needed to do such assembly and thereby increases the manufacturing cost of the thermal module 1.
Moreover, the cooling fan 11 vibrates when it operates, bringing the whole thermal module 1 to produce noise or vibration.
In brief, the conventional thermal module with a cooling fan has the following disadvantages: (1) having complicated structure; (2) requiring a lot of time and labor to assemble; (3) having increased manufacturing cost; and (4) easy to produce vibration.
Method used
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[0018]Please refer to FIGS. 2, 3, 4, 5, 5A, and 6. A cooling fan housing assembly 2 according to a preferred embodiment of the present invention includes a boosting portion 21 and a connecting portion 22 extended from an end of the boosting portion 21. The connecting portion 22 includes a first part 221 and a second part 222. The first and the second part 221, 222 can be covered on and fitted around a heat sink 3. The second part 222 of the connecting portion 22 is provided with at least one hooking section 2221 for hooking to the heat sink 3. The boosting portion 21 defines a first open end 211, a second open end 212, and a flow passage 213 communicating the first open end 211 with the second open end 212.
[0019]The first part 221 of the connecting portion 22 has an end that is integrally extended from the boosting portion 21, and another opposite end that is integrally extended to form the second part 222. As can be seen from FIGS. 4, 5, and 6, the first part 221 of the connecting ...
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A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part and a second part for covering on and fixing to the heat sink. The second part of the connecting portion is provided with at least one hooking section for firmly hooking to the heat sink, so that a cooling fan supported on the cooling fan housing assembly can be quickly assembled to the heat sink without the risk of producing vibration during the operation of the cooling fan. Therefore, the cooling fan housing assembly not only reduces assembling labor and time and manufacturing cost, but also enables stable operation of the cooling fan.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a cooling fan housing assembly and a thermal module consisting of such cooling fan housing assembly, and more particularly to a cooling fan housing assembly that can be quickly and stably assembled to a heat sink to provide a thermal module.BACKGROUND OF THE INVENTION[0002]When an electronic device operates, the internal electronic components thereof would produce heat. Therefore, a heat-dissipating unit is required to help in increasing the heat-dissipation efficiency of the electronic device to avoid burnout or other damages of the electronic components due to overheating. The heat-dissipating unit is mainly a radiating fin assembly or a heat sink. Since the above-described heat-dissipating unit alone can only achieve limited effect in dissipating the heat produced by the electronic components, at least one cooling fan is associated with the heat-dissipating unit, so that the cooling fan produces and forces airflows thro...
Claims
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IPC IPC(8): H05K5/00H05K7/00H05K7/20H01L23/34
CPCH01L23/467H01L2924/0002H01L2924/00
Inventor LIN, SHENG-HUANG
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD