Method and apparatus for processing metal bearing gases

Abstract

A method and apparatus for processing metal bearing gases involves generating a toroidal plasma in a plasma chamber. A metal bearing gas is introduced into the plasma chamber to react with the toroidal plasma. The interaction between the toroidal plasma and the metal bearing gas produces at least one of a metallic material, a metal oxide material or a metal nitride material.

Description

RELATED APPLICATIONS[0001]This application is a continuation of Ser. No. 12 / 511,785, filed on Jul. 29, 2009, now U.S. Pat. No. 8,124,906, which is a divisional application of Ser. No. 11 / 269,917, filed on Nov. 8, 2005, now U.S. Pat. No. 7,569,790, which is a continuation-in-part of Ser. No. 10 / 837,912, filed on May 3, 2004, now U.S. Pat. No. 7,166,816, which is a continuation of Ser. No. 09 / 804,650, filed on Mar. 12, 2001, now U.S. Pat. No. 6,815,633, which is a continuation-in-part of Ser. No. 09 / 774,165, filed on Jan. 26, 2001, now U.S. Pat. No. 6,924,455, which is a continuation-in-part of Ser. No. 09 / 659,881, filed on Sep. 12, 2000, now U.S. Pat. No. 6,486,431, which is a continuation of Ser. No. 08 / 883,281, filed on Jun. 26, 1997, now U.S. Pat. No. 6,150,628, the entire disclosures of which are incorporated herein by reference. In addition, this application claims priority to U.S. Provisional Patent Application Ser. No. 60 / 625,838, filed on Nov. 8, 2004.FIELD OF THE INVENTION[0...

AI Technical Summary

Benefits of technology

[0022]In one embodiment, the plasma chamber is formed of metal. Metal plasma chambers include multiple dielectric regions that prevent induced current flow from forming in the plasma chamber. In one embodiment, the metal plasma chamber is segmented with multiple dielectric gaps to reduce the potential difference between the plasma and the metal plasma chamber, thereby distributing the plasma loop voltage across multiple dielectric gaps. The segmented plasma chamber facilitates operating the plasma source at relatively high loop voltages, while reducing or eliminating the plasma channel surface erosion. In another embodiment, circuit elements are used to control the voltage distribution across the metal plasma chamber.

[0023]In one embodiment, the power supply of the high power source includes a voltage regulator circuit that provides a stable DC bus voltage that allows the user to precisely control the total power supplied to the plasma. In one embodiment, the high power toroidal plasma source of the present invention includes an apparatus for reliably igniting the plasma.

[0024]The invention, in another aspect, features a high power toroidal plasma source. The high power toroidal plasma source, in one embodiment of the present invention, has numerous advantages. The high power plasma source generates a relatively high power plasma with higher operating voltages that has increased dissociation rates and that allow a wider operating pressure range. Also, the high power plasma source has precise process control. In addition, the high power plasma source has relatively low plasma chamber surface erosion.

[0026]In another embodiment, the plasma chamber is formed of an electrically conductive material and at least one dielectric region that forms an electrical discontinuity in the conductive material. The electrically conductive material may be aluminum and the aluminum may be anodized. The electrically conductive material may be segmented with at least two dielectric gaps. The dielectric gaps reduce the potential difference between the plasma and the metal plasma chamber, thereby distributing the plasma loop voltage across the at least two dielectric gaps. A voltage divider circuit may be electrically coupled across the at least two dielectric gaps to distribute the plasma loop voltage across the at least two dielectric gaps.

Problems solved by technology

For example, some applications require the use of ions with low kinetic energy (i.e. a few electron volts) because the material being processed is sensitive to damage.

However, microwave and inductively coupled plasma sources require expensive and complex power delivery systems.

However, prior art RF inductively coupled plasmas are not purely inductive because the drive currents are only weakly coupled to the plasma.

Consequently, RF inductively coupled plasmas are inefficient and require the use of high voltages on the drive coils.

The ion bombardment deteriorates the reactor and can contaminate the process chamber and the material being processed.

The ion bombardment can also cause damage to the material being processed.

However, because of the relatively weak coupling of the drive coil currents to the plasma, large eddy currents form in the shields resulting in substantial power dissipation.

The cost, complexity, and reduced power efficiency make the use of Faraday shields unattractive.