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Inductor element and integrated circuit device

a technology of integrated circuit and integrated circuit, which is applied in the direction of reradiation, instruments, and the details of the semiconductor/solid-state device, can solve the problems of power consumption increase and transmission efficiency drop, and achieve the effect of increasing the density of the integration of the integrated circuit and maintaining the quality of communication

Active Publication Date: 2014-10-28
THRUCHIP JAPAN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0070]The disclosed inductor element and integrated circuit device make it possible for a peripheral wire to run through a coil having large dimensions, and as a result the density of the integration of the integrated circuit can be increased while maintaining the quality of communication of inductive coupling communication over a long distance. This inductor element can be used as an antenna for wireless communication, such as inductive coupling communication, and in addition can be used as an inductor in various circuits, such as oscillator circuits and amplifier circuits.

Problems solved by technology

In order to compensate for this, it is necessary to increase the output, and therefore such a problem arises that the power consumption increases.
In accordance with this method as well, however, such a problem arises that the transmission efficiency lowers when there are three or more semiconductor chips.

Method used

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  • Inductor element and integrated circuit device
  • Inductor element and integrated circuit device
  • Inductor element and integrated circuit device

Examples

Experimental program
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Effect test

first embodiment

[0101]Next, on the basis of the above description, the inductor element according to the first embodiment of the present invention is described in reference to FIG. 2. FIG. 2 is a schematic perspective diagram showing the inductor element according to the first embodiment of the present invention, in which a case of a one-wound coil made of wires M4 and M5 is illustrated in order to simplify the description. Here, the first coil element 10 and the second coil element 30 are connected through a connection via 20 so as to form the one-wound coil. M4 and M5 represent layer levels such that M4 means a metal wire layer in the fourth layer.

[0102]First, the wires M2 and M6 in the metal wire layers directly above and below the first coil element 10 made of the wire M4 form shield wire elements 41, 42 provided parallel to the first coil element 10 made of the wire M4. Meanwhile, the wires M3 and M7 in the metal wire layers directly above and below the second coil element 30 made of the wire ...

second embodiment

[0106]Next, the inductor element according to the second embodiment of the present invention is described in reference to FIG. 3. FIG. 3 is a schematic plan diagram showing the inductor element according to the second embodiment of the present invention in which a case of a one-wound coil made of the wire M4 and M5 is illustrated in order to simplify the description. Here, the first coil element 10 and the second coil element 30 are connected through a connection via 20 so as to form the one-wound coil.

[0107]In the second embodiment of the present invention, shield wire elements 51, 52 are formed of the wire M4 to the left and right of and very close to the first coil element 10 made of the wire M4. Meanwhile, shield wire elements 53, 54 are formed of the wire M5 to the left and right of and very close to the second coil element 30 made of the wire M5. The shield wire element 51 and the shield wire element 53 are connected through a connection via 25, and at the same time the shield...

third embodiment

[0110]Next, the inductor element according to the third embodiment of the present invention is described in reference to FIG. 4. FIG. 4 is a schematic perspective diagram showing the inductor element according to the third embodiment of the present invention, in which a case of a one-wound coil made of the wire M4 and the wire M5 is illustrated in order to simplify the description. Here, the first coil element 10 and the second coil element 30 are connected through a connection via 20 so as to form the one-wound coil.

[0111]In the third embodiment, wire prohibiting regions 61, 62 are provided such that the wire M2 and the wire M6 in the metal wire layers directly above and below the first coil element 10 made of the wire M4 prohibit a peripheral wire from being provided, and at the same time wire prohibiting regions 63, 64 are provided such that the wire M3 and the wire M7 in the metal wire layers directly above and below the second coil element 30 made of the wire M5 prohibit a peri...

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Abstract

The invention relates to an inductor element and an integrated circuit device where the efficiency of use of wire materials is high and noise interference through capacitive / inductive coupling from peripheral wires is low.Coil elements 1, 2 are provided in at least two adjacent layer levels having main wires which run in different directions so that each coil element 1 (2) is connected to a coil element 2 (1) in a different layer level so as to form one coil, and shield wires 3, 4 are connected to a power 5 either above or below or to the left or right of said coil elements 1, 2.

Description

TECHNICAL FIELD[0001]The present invention relates to an inductor element and an integrated circuit device, and in particular to an inductor element for magnetic communication between substrates, such as of IC bare chips and printed circuit boards, and an integrated circuit device which is characterized by the structure for reducing noise caused by capacitive coupling between the inductor element and the peripheral wires.BACKGROUND ART[0002]In recent years, mounting semiconductor integrated circuit devices on a substrate with high density has been required since portable electronic devices have been miniaturized, and in response to this, layering a number of semiconductor chips three-dimensionally has been attempted.[0003]In such a three-dimensionally mounted semiconductor integrated circuit device, the semiconductor chips are generally connected through microbumps in order to exchange signals between the semiconductor chips. In the case where three or more semiconductor chips are l...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01F27/32
CPCH01L2924/3011H01F2017/008H04B5/0031H01F17/0006H04B5/0081H01L23/5227H01L2924/0002H01L23/5225H01L2924/00H01L28/10
Inventor KURODA, TADAHIRO
Owner THRUCHIP JAPAN INC