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Electronic part

a technology of electronic parts and components, applied in the field of electronic parts, can solve the problems of affecting the performance of the electronic part, the failure of the soldering device to fully prevent the occurrence the explosion of the soldering device, etc., and achieve the effect of high joint strength

Active Publication Date: 2016-06-14
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012]The present invention was made to solve the above-mentioned problems, and it is an object of the present invention to provide an electronic part which does not cause solder burst in mounting the electronic part by soldering and which can be mounted by soldering highly reliably, and further an electronic part which does not generate whiskers in performing mounting by soldering and which has high joint strength at a high temperature.

Problems solved by technology

However, when an electronic part having a plating layer formed on the surface thereof by plating is mounted by soldering, there is a problem that a plating solution or a cleaning solution remaining within the external electrode is exposed to a high temperature at the time of soldering to rapidly vaporize, and causes solder explosion (solder burst), and thereby a short circuit occurs between neighboring electrodes or electronic parts.
However, since a glass component which is more or less soluble in a plating solution is used in the Cu thick-film electrode, it is difficult to completely prevent the occurrence of solder burst with a method of optimizing (densifying) an external electrode alone.
Further, the plating solution is often intended to be improved, but dissolution of the glass component cannot be completely prevented, and it is actually impossible to completely avoid the occurrence of solder burst.
Further, when an outermost layer of the plating layer formed on the external electrode is a Sn plating layer as with the capacitor described in Examples of Patent Document 1, there is a problem that whiskers, in which crystals of Sn grow out from the surface of the plating layer, are generated, and these whiskers cause a short circuit.Patent Document 1: Japanese Patent Laid-open Publication No. 2005-101470

Method used

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Examples

Experimental program
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Effect test

embodiment 1

[0042]An electronic part (laminated ceramic capacitor) A1 of Embodiment 1 shown in FIG. 1 is formed by arranging a pair of external electrodes 5, 5, so as to be electrically conductive to internal electrodes 2, at both end faces 4, 4 of a ceramic laminate (laminated ceramic device) 1 of an electronic part main body having a structure in which the internal electrodes 2 are laminated with ceramic layers (dielectric ceramic layers) 3 as dielectric layers interposed therebetween, and alternately pulled out to both the end faces 4, 4 of the ceramic laminate.

[0043]The external electrode 5 includes a Cu thick-film electrode layer 50, a Cu—Ni alloy layer or a Cu—Mn alloy layer (hereinafter, also referred to as simply an “alloy layer”) 10 formed thereon by plating, and a Sn plating layer (the Sn-containing layer in the present invention) 20 formed by plating on the alloy layer 10.

embodiment 2

[0044]As with the electronic part (laminated ceramic capacitor) A1 shown in FIG. 1, an electronic part (laminated ceramic capacitor) A2 of Embodiment 2 shown in FIG. 2 is also formed by arranging a pair of external electrodes 5, 5 so as to be electrically conductive to internal electrodes 2, at both end faces 4, 4 of a ceramic laminate (laminated ceramic device) 1 of an electronic part main body having a structure in which the internal electrodes 2 are laminated with ceramic layers (dielectric ceramic layers) 3 as dielectric layers interposed therebetween, and alternately pulled out to both the end faces 4, 4 of the ceramic laminate.

[0045]However, in the electronic part A2 in FIG. 2, the external electrodes 5, 5 include Cu—Ni alloy layers (thick-film Cu—Ni alloy layers) or Cu—Mn alloy layers (thick-film Cu—Mn alloy layers) 10a formed at both the end faces 4, 4 of the ceramic laminate (laminated ceramic device) 1, and Sn plating layers (the Sn-containing layer in the present inventio...

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Abstract

An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation of International application No. PCT / JP2013 / 053237, filed Feb. 12, 2013, which claims priority to Japanese Patent Application No. 2012-048026, filed Mar. 5, 2012, the entire contents of each of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to an electronic part, and more particularly to an electronic part including an external electrode that is configured to join, by soldering, the external electrode to a joining object such as a land electrode for mounting.BACKGROUND OF THE INVENTION[0003]Surface-mounted electronic parts such as a chip capacitor and a chip inductor are usually mounted by soldering an external electrode formed in an electronic part main body, for example, to a land electrode for mounting disposed on a substrate.[0004]As such electronic parts, an electronic part, which has an external electrode provided with a Sn plating layer ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01G4/30H01G4/12H01G4/232H01G2/04H01G4/008H01G4/252
CPCH01G4/12H01G2/04H01G4/008H01G4/2325H01G4/30H01G4/252
Inventor TAKAOKA, HIDEKIYONAKANO, KOSUKEOTA, YUTAKAKAWASAKI, KENICHI
Owner MURATA MFG CO LTD