Method and device for mounting electronic component

Abstract

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Description

[0001]This is a division of application Ser. No. 09 / 109,352, filed Jul. 2, 1998 now U.S. Pat. No. 6,230,393.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a component mounting method and device which are used in a component mounting apparatus for mounting an electronic component on an electrode in a process of mounting operation in which a paste of cream solder is applied on an electrode on a circuit board, on which an electronic component which is positioned above the electrode is mounted, after which the cream solder is heated and melted to join the component onto the electrode.[0004]2. Description of the Related Art[0005]FIG. 4 is a plan view typically showing a primary structure of a component mounting device, in which a plurality of parts cassettes 42 in a component feeding unit 43, respectively accommodating different types of electronic components, are moved to a position where the component is picked up by a suction nozzle un...

AI Technical Summary

Benefits of technology

The present invention provides a component mounting device and method that can keep the quality of mounted conditions of components without causing interference between previously mounted components and the nozzle, even when the center of the nozzle and that of the component are not correspondent to each other. This device can also inform an operator of abnormality and stop mounting action to prevent interference between the component and the nozzle, allowing investigation and confirmation of causes of the abnormality. By analyzing the posture of the component held by the component suction nozzle with respect to all the electronic components detected at the posture recognizing position, the tendency of displacement in the component feeding position with respect to the pick-up position of the suction nozzle can be recognized, which can be used to adjust the component feeding position to the component pick-up position in a direction for correcting displacement, allowing precise pick-up of the component in a predetermined position of the component suction nozzle and accurate mounting on the circuit substrate with high mounting density.

Problems solved by technology

However, in high density chip mounting of recent years, the space between two adjacent components have become smaller and smaller.

As a result, especially in the case where the outer dimensions of the component are smaller than those of the suction nozzle, and under a condition that the center of the suction nozzle and that of the component are not in register with each other, it is often the case that the suction nozzle and an electronic component which has previously mounted on the circuit board interfere with each other, thus causing mounting errors.

In such a case, since the mounting order is different from the normal one, the component has to be mounted between the other components which have already been mounted, wherefore if the position of the component held by the suction nozzle is displaced, it is more often the case that the suction nozzle and the previously mounted component interfere with each other, causing frequent errors in mounting operation of the components onto the circuit substrate 44.

In particular, it may cause a serious problem if the height of the component which has already been mounted is larger than that of the component which is going to be mounted later.

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