The present invention provides a micro-electromechanical
system, which includes: a housing defining a cavity and an opening communicating with the cavity; a diaphragm mounted at the opening; at least one
cantilever located in the cavity, the
cantilever including a first end, a second end and a fulcrum located between the first end and the second end; a
plunger located between the diaphragm and the
cantilever and used to transmit the displacement of the diaphragm to the first end of the cantilever; and a sensor element connected to the second end of the cantilever; wherein the distance between the first end and the fulcrum is less than the distance between the second end and the fulcrum. The micro-electromechanical
system of the present invention has the advantages of high
signal-to-
noise ratio, small packaging volume, high sensitivity, etc. The stiffness of the diaphragm of the present invention is an
order of magnitude higher than that of the diaphragm of the related art, avoiding mechanical collapse and large DC deformation under 1 standard
atmosphere (atm).