The present invention provides an imprinting method and device. First, an unstrengthened
wafer is
cut according to a preset shape to obtain a plurality of sub-wafers, then the sub-wafers are subjected to high-intensity strengthening treatment, and finally, an imprinting
resist is applied onto the strengthened sub-wafers and imprinted to form micro-nano structures. In this way, the
cutting and strengthening processes are performed in advance, eliminating the need for
cutting and strengthening after the imprinted structures are formed, thus effectively preventing damage to the imprinted structures caused by subsequent
cutting and strengthening. In addition, the imprinting device provided in the present invention is employed during imprinting. Before imprinting, a soft film tension adjusting
assembly is located at a first height, so that the tension of a flexible soft film satisfies the requirement for tensioning the flexible soft film; and during imprinting, the soft film tension adjusting
assembly is located at a second height, so that the tension of the flexible soft film is kept at zero. The technical solution provided in the present application can improve an imprinting effect.