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Central type flow guiding heat radiation device

A technology of diversion heat dissipation and heat dissipation mechanism, which is applied in the direction of semiconductor devices, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., which can solve the problem that the heat conduction effect is not fast enough, affects the working stability of the heat source 12, and cannot reach the heat generation Source 12 surface and other issues

Inactive Publication Date: 2007-10-03
ORRA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Although the temperature coefficients of aluminum metal and copper metal are 218 and 418 respectively, the heat conduction effect of their mutual matching is still not fast enough, so that after the temperature transfer between the heat sink 13 and the heat source 12, the surface temperature of the heat source 12 remains still It is higher than the temperature inconsistency of the heat sink 13, that is, the wind blown by the heat dissipation fan 14 only reaches the shell of the heat sink 13, and cannot reach the surface of the heat source 12, commonly known as poor heat dissipation effect of external heat dissipation
[0004] 2. It is worth mentioning that when the heat source 12 is in operation, the temperature accumulated on its surface will gradually increase. However, the external heat dissipation function of the above-mentioned heat sink cannot reduce the high operating temperature of the heat source 12 in time, which will affect The working stability of the heat source 12 may cause the computer installed with the heat source 12 to crash, or cause damage due to excessive operating temperature.

Method used

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  • Central type flow guiding heat radiation device
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Embodiment Construction

[0020] For the convenience of description, in the following embodiments, similar elements are denoted by the same reference numerals.

[0021] As shown in Figures 2 and 5, the first preferred embodiment of the central diversion heat dissipation device 2 of the present invention is installed on a heat source 3, which can be a central processing unit (CPU) , Integrated circuit chips (IC), circuit modules, etc. and other heat sources; in this example, the heat source 3 is a central processing unit; the central heat dissipation device 2 includes a heat sink mounted on the heat source 3 The heat dissipating mechanism 4, at least one heat conductor 5 installed in the heat dissipating mechanism 4, an exhaust fan mechanism 6 installed above the top of the heat dissipating mechanism 4, and a heat conductive paste 7 coated with the heat conductor 5.

[0022] As shown in FIGS. 3, 4, and 5, the heat dissipation mechanism 4 includes a superheat conductive assembly 40 that can be attached to th...

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Abstract

This invention provides a central diversion heat abstractor mounted on a heat source with a radiation unit set on it and a fan unit on the radiation unit which includes a super thermal conducting complex capable of adhering to the source and conducting the main heat source from the source up ward quickly, several interval rings are set on the fins of the complex with one on the shell outside the fins, and one inlets surrounding the bottom of the shell.

Description

(1) Technical field [0001] The present invention relates to a heat dissipation device, in particular to a central flow guiding and heat dissipation device capable of quickly transmitting temperature. (2) Background technology [0002] As shown in Figure 1, a general heat sink is installed on top of a heat source 12 on a substrate 11. The heat source 12 can be a central processing unit (CPU), integrated circuit chip (IC), module... The heat dissipation device includes an aluminum heat sink 13 attached to the heat source 12, and a heat dissipation fan 14 blowing toward the heat sink 13. The bottom of the heat sink 13 is provided with a copper metal heat conducting sheet 15; The relatively high temperature conductivity of copper metal quickly transfers the surface temperature of the heat source 12 to the fins of the aluminum heat sink 13, and a better heat dissipation effect is achieved by enlarging the heat dissipation area. However, the above heat dissipation effect actually still...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/467H01L23/367H05K7/20G06F1/20H01L23/34
CPCH01L2924/0002H01L2924/00
Inventor 骆俊光
Owner ORRA CORP