Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus

Abstract

The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

Description

technical field [0001] The present invention relates to a recovery processing method, a substrate processing apparatus, and a program when a substrate processing apparatus that performs predetermined processing on a substrate to be processed such as a semiconductor wafer or a liquid crystal substrate stops operating due to an abnormality. Background technique [0002] Generally, such a substrate processing apparatus includes: a processing unit having a plurality of processing chambers for performing prescribed processing on substrates to be processed, such as semiconductor wafers (hereinafter all simply referred to as "wafers"); And the delivery unit connected to the processing unit. [0003] For example, in a multi-stage substrate processing apparatus, the processing unit is generally configured by connecting the plurality of processing chambers and load-lock chambers in a gas-tight manner around a common transfer chamber formed in a rectangular shape. A processing unit-si...

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Problems solved by technology

However, continuous processing in a plurality of processing chambers requires wafers to stay in a common transfer chamber while being transported to the next processing chamber, or the processing in a certain processing chamber is interrupted in the middle and stays in the processing chamber. In the case of indoors, etc., depending on the processing stage of the wafer, if it is exposed to the atmosphere at that stage, it may not be possible to save the wafer

For example, in the case of cluster processing, etc., the remaining processing (such as supplementary etching processing, etc.) cannot be performed on the wafer due to the interrupted processing in the middle, so the wafer cannot be saved.

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