Fixing structure for heat-conducting block
A technology of fixed structure and thermal conduction block, which is applied in the direction of semiconductor/solid-state device components, electric solid-state devices, semiconductor devices, etc., can solve the problems of inability to install heat sinks, complex geometry of thermal conduction blocks, and limited scope of application of thermal conduction blocks.
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[0062] The invention separates the heat sink and the fixing structure to simplify the structural change of the heat sink, and can be applied to heat sources and fixing seats of different shapes in one piece, without changing the design of the heat sink for the chip and the shape of the fixing seat, only for The fixed structure is changed.
[0063] see Figure 1 to Figure 3 As shown, a heat conduction block fixing structure 100 provided by the first preferred embodiment of the present invention is applied to a heat dissipation device 200, and the heat dissipation device 200 includes:
[0064] A heat conduction block 210 is a rectangular block made of metal. The heat conduction block 210 is made of copper as a material through cutting and forming, and it can also be made of aluminum as a material by extrusion casting. A plurality of The accommodating portions 211 are parallel to each other, and each accommodating portion 211 is recessed on the upper surface of the heat conducti...
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