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Fixing structure for heat-conducting block

A fixed structure and heat conduction block technology, which is applied in semiconductor/solid-state device components, electric solid-state devices, semiconductor devices, etc., can solve problems such as inability to install heat sinks, limited application range of heat conduction blocks, wrong selection, etc.

Inactive Publication Date: 2006-12-13
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The scope of application of the heat conduction block is limited to a specific chip and the shape of the holder, so that the cooling device using the heat pipe must be assembled and produced in accordance with the shape of the holder, causing troubles for manufacturers
When users use this type of cooling device, they are also prone to selection errors, and cannot install the cooling device they hold on the chip to be cooled.
[0004] In addition, in order to improve the thermal conductivity of the heat conduction block, the heat conduction block is mostly made of copper by cutting. In order to match the fixing seat, the geometric shape of the heat conduction block will become complicated, so that the processing of the heat conduction block must go through multiple cutting procedures. , time-consuming and increase processing cost
Although aluminum extrusion can reduce costs, if the heat conduction block is to be applied to different holders, different molds and production lines must be installed at the same time, and the cost consumption is also very alarming, and aluminum extrusion products still need to be further processed. To complete complex structural design

Method used

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  • Fixing structure for heat-conducting block
  • Fixing structure for heat-conducting block
  • Fixing structure for heat-conducting block

Examples

Experimental program
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Embodiment Construction

[0062] In the present invention, the heat sink and the fixing structure are arranged separately to simplify the structural change of the heat sink, and can be applied to heat sources and fixing seats of different shapes in one body, without changing the design of the heat sink for the chip and the shape of the fixing seat, only for The fixed structure is changed.

[0063] see Figure 1 to Figure 3 As shown, a heat conduction block fixing structure 100 provided by the first preferred embodiment of the present invention is applied to a heat dissipation device 200, and the heat dissipation device 200 includes:

[0064] A heat conduction block 210 is a rectangular block made of metal. The heat conduction block 210 is made of copper as a material through cutting and forming. It can also be made of aluminum as a material by extrusion casting. A plurality of The accommodating portions 211 are parallel to each other, and each accommodating portion 211 is recessed on the upper surface...

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PUM

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Abstract

The invention discloses a fixing structure of heat conductivity block, which consists of joint board and fixing board, wherein the joint board possesses multiple chuck pieces, which parallel the joint board; multiple chuck holes are opened on the fixing board to correspond to chuck pieces, which connect the joint board and fixing board; the fixing board connects the fixing seat with heat source in the center, which is fixed on the heat conductive block to absorb energy of heat source.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a fixing structure of a heat conduction block for fixing a heat conduction block on a heat source. Background technique [0002] The heat pipe (heat pipe) conducts heat transfer through the two-phase (liquid phase, gas phase) change of the fluid, so that the heat pipe has an excellent heat transfer coefficient. Today's computer mainframes are gradually miniaturized, which reduces the internal space, which is not conducive to air circulation and affects the operation of traditional air-cooled radiators. Therefore, heat pipes are applied to the chips inside the computer to dissipate heat, directly dissipating the heat generated by the chips during operation. Conducted to the ventilation, such as the vents on the side of the computer mainframe casing, so as to dissipate the heat to the outside and cool the chip. [0003] A heat dissipation device using a heat pipe generally includes thr...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/427G06F1/20H05K7/20
Inventor 刘宜松邓裕晃
Owner GIGA BYTE TECH CO LTD