Polyimide/inorganic nano-composite laminated board and its preparation method
An inorganic nano and polyimide technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc. higher question
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example 1
[0019] In a 100L reactor, weigh 90Kg of dimethylacetamide, start stirring, add 21.22mol of 4,4'-diaminodiphenylether, and stir at room temperature until completely dissolved. Turn on the cooling water of the reaction kettle, slowly add 21.75 mol of diphenyl ether tetracarboxylic dianhydride in batches, properly cool the reaction kettle and control the feeding speed, and control the material temperature not to exceed 45°C. After the addition of diphenyl ether tetracarboxylic dianhydride was completed, the mixture was stirred at room temperature for 4 hours. After the viscosity of the material reaches the maximum, it rises to 85°C and degrades until the viscosity of the material drops to: Measured at 23±2°C by the No. 4 cup method, the viscosity is 20-50 seconds. A brown to brown-red viscous transparent liquid is obtained, which is the precursor of component 1 (meltable polyimide resin component).
[0020] Add SiO with an average particle size of 10nm to 20nm to the precursor o...
example 2
[0025] In Example 1, Al with an average particle size of 200nm to 300nm 2 o 3 Powder 4.5Kg instead of SiO 2 Powder, the proportioning and preparation process of the remaining raw materials are unchanged, and another kind of high thermal conductivity polyimide / nano-Al involved in the present invention can be obtained 2 o 3 Composite laminates, the thermal conductivity is 0.65-0.70W / (m K), the bending strength under normal conditions is 250-280MPa, the bending strength at 300°C is 180-200MPa, and the volume resistivity at 350°C is not less than 2.0× 10 8 Ω·m, long-term heat resistance not lower than 300°C.
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