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Polyimide/inorganic nano-composite laminated board and its preparation method

An inorganic nano and polyimide technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc. higher question

Inactive Publication Date: 2008-06-04
GUILIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The long-term heat resistance of polyimide laminates currently on the market is generally not higher than 250°C. For some special applications, its heat resistance still cannot meet the requirements of some high-tech products; its thermal conductivity is mostly relatively low , generally between 0.30 and 0.40W / (m K), which is not conducive to the heat dissipation of motor electrical windings and microelectronic components, resulting in a further increase in operating temperature and a decrease in reliability

Method used

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  • Polyimide/inorganic nano-composite laminated board and its preparation method
  • Polyimide/inorganic nano-composite laminated board and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0019] In a 100L reactor, weigh 90Kg of dimethylacetamide, start stirring, add 21.22mol of 4,4'-diaminodiphenylether, and stir at room temperature until completely dissolved. Turn on the cooling water of the reaction kettle, slowly add 21.75 mol of diphenyl ether tetracarboxylic dianhydride in batches, properly cool the reaction kettle and control the feeding speed, and control the material temperature not to exceed 45°C. After the addition of diphenyl ether tetracarboxylic dianhydride was completed, the mixture was stirred at room temperature for 4 hours. After the viscosity of the material reaches the maximum, it rises to 85°C and degrades until the viscosity of the material drops to: Measured at 23±2°C by the No. 4 cup method, the viscosity is 20-50 seconds. A brown to brown-red viscous transparent liquid is obtained, which is the precursor of component 1 (meltable polyimide resin component).

[0020] Add SiO with an average particle size of 10nm to 20nm to the precursor o...

example 2

[0025] In Example 1, Al with an average particle size of 200nm to 300nm 2 o 3 Powder 4.5Kg instead of SiO 2 Powder, the proportioning and preparation process of the remaining raw materials are unchanged, and another kind of high thermal conductivity polyimide / nano-Al involved in the present invention can be obtained 2 o 3 Composite laminates, the thermal conductivity is 0.65-0.70W / (m K), the bending strength under normal conditions is 250-280MPa, the bending strength at 300°C is 180-200MPa, and the volume resistivity at 350°C is not less than 2.0× 10 8 Ω·m, long-term heat resistance not lower than 300°C.

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Abstract

A laminated polyimide / inorganic nano-material plate is prepared from soluble polyimide resin, inorganic non-metal nanoparticles (or superfine particles) and non-alkali glass fibre cloth through mixing the precursor of polyimide resin with said nanoparticles, high-speed dispersing or grinding to obtain resin adhesive, coating it on said glass fibre cloth, baking, imidoylating, cutting by predefined sizes, overlapping, and die pressing.

Description

technical field [0001] The invention relates to a polyimide / inorganic nano composite laminate and a preparation method thereof. Background technique [0002] The long-term heat resistance of polyimide laminates currently on the market is generally not higher than 250 ° C. For some special applications, its heat resistance still cannot meet the requirements of some high-tech products; its thermal conductivity is mostly relatively low , generally between 0.30 and 0.40W / (m·K), which is not conducive to the heat dissipation of motor electrical windings and microelectronic components, resulting in a further increase in operating temperature and a decrease in reliability. Contents of the invention [0003] The object of the present invention is to provide a polyimide / inorganic nanocomposite laminate with high heat resistance and thermal conductivity and a preparation method thereof. The long-term heat resistance of this nano-composite laminate is not lower than 300°C, and the t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00
Inventor 饶保林张明艳史博
Owner GUILIN UNIVERSITY OF TECHNOLOGY