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Al-Cu-Sn series lead-free soldering tin

A technology of lead-free solder and al-cu-sn, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problem of high cost and achieve the effect of low cost, simple composition and abundant resources

Inactive Publication Date: 2008-06-25
吴江海博科技创业投资有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most widely used Sn 96.5 Ag 3.5 Lead-free solder, because it contains silver, the cost is higher

Method used

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  • Al-Cu-Sn series lead-free soldering tin
  • Al-Cu-Sn series lead-free soldering tin
  • Al-Cu-Sn series lead-free soldering tin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 1) Using pure Al, pure Cu, and pure Sn as raw materials, prepare 1 kg of alloy material by weight percentage, wherein 30.0g Al, 10.0g Cu, and the rest are Sn and unavoidable impurities;

[0021] 2) Put the alloy material into the vacuum induction melting furnace, vacuumize it, and then fill it with argon;

[0022] 3) Adjust the power of the induction melting furnace so that the furnace temperature reaches 950°C for smelting, casting a rod with a diameter of 28 mm, machining it into a tensile sample with a diameter of 5 mm, and taking a sample for a differential scanning calorimetry (DSC) curve According to the measurement, the composition of the lead-free solder sample is 3.0% Al, 1.0% Cu, and the rest is Sn and unavoidable impurities.

[0023] The melting point of the sample measured by DSC is 231.1°C, the tensile strength is 6.0MPa, and the elongation is 23.1%. figure 1 is the DSC curve of the sample heating and cooling process.

Embodiment 2

[0025] 1) with pure Al, pure Cu, pure Sn as raw material, prepare 50 grams of alloy material by weight percentage, wherein 0.5g Al, 2.0g Cu, all the other are Sn and unavoidable impurity;

[0026] 2) Put the alloy material into a quartz glass tube with a diameter of 12mm, evacuate, and seal the quartz glass nozzle under a high-temperature flame under the condition that the temperature of the alloy material does not rise;

[0027] 3) Put the sealed quartz glass tube into a vertical electric furnace, heat up to 900°C at a rate of 2°C / min, turn off the power after 2 hours of heat preservation, and cool to 300°C with the furnace, take out the quartz glass tube and put it in cold water immediately In the lead-free solder sample, the composition is 1.0% Al, 4.0% Cu, and the rest is Sn and unavoidable impurities.

[0028] The sample is machined into a tensile sample with a diameter of 5mm, and the sample is taken to measure the differential scanning calorimetry (DSC) curve. The melti...

Embodiment 3

[0030] 1) Using pure Al, pure Cu, and pure Sn as raw materials, prepare 1 kg of alloy material by weight percentage, wherein 10.0g Al, 60.0g Cu, and the rest are Sn and unavoidable impurities;

[0031] 2) Put the alloy material into the vacuum induction melting furnace, vacuumize it, and then fill it with argon;

[0032] 3) Adjust the power of the induction melting furnace so that the temperature of the furnace reaches 1000°C for melting, and then cast it into a rod with a diameter of 28 mm. The composition of the lead-free solder sample is 1.0% Al, 6.0% Cu, and the rest is Sn and unavoidable impurities.

[0033] The melting point of the sample measured by DSC is 228.3°C, image 3 is the DSC curve of the sample heating and cooling process.

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Abstract

The present invention relates to an Al-Cu-Sn series leadless solder. Its composition includes (by wt%) 0.1-3.0% of Al, 0.1-10.0% of Cu, the rest is Sn and inevitable impurity. Said Al-Cu-Sn series leadless solder is approaching to eutectic component, and its melting point is 228-233deg.C.

Description

technical field [0001] The invention relates to a solder material, in particular to an Al-Cu-Sn lead-free solder material suitable for the fields of electronic assembly and packaging, electrical equipment, communication equipment and the like. Background technique [0002] use Sn 63 Pb 37 Lead is inevitably contained in electronic products made of solder. When such electronic products are discarded or recycled, they will pollute the environment and bring harm to human health. In order to eliminate the pollution of lead in waste electronic products to the environment and the harm to human health. The Ministry of Information Industry of my country formulated the "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" in March 2003, which clearly stipulates: "Producers should take measures to gradually reduce and eliminate lead, mercury, cadmium, hexavalent chromium, and polybrominated bromide in electronic information products...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 黄德欢李宗全夏志平周颖
Owner 吴江海博科技创业投资有限公司