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Fan structure

A fan and component technology, applied in the field of fans that can increase the heat dissipation rate and effect, can solve the problems of high temperature of the integrated circuit body, the integrated circuit cannot continue to function, and high heat, so as to improve the lifespan, improve the current capacity, and improve the heat dissipation. The effect of efficiency

Inactive Publication Date: 2008-07-23
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, however, although lower currents can be used, the current flows directly into the integrated circuit, generating higher heat
When the heat cannot be eliminated in time, it will accumulate on the surface of the integrated circuit, causing the temperature of the integrated circuit body to be too high, so that the integrated circuit cannot continue to perform its due characteristics, and even thermal shutdown occurs.

Method used

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Embodiment Construction

[0033] figure 1 A schematic diagram showing the fan circuit board of the first preferred embodiment of the present invention. figure 2 A schematic diagram showing a fan using the fan circuit board of the present invention. Please also refer to figure 1 and figure 2 The fan structure 200 of the present invention has a hub 202 , a motor component (not shown) inside the hub 202 , a blade component 204 connected to the hub 202 and a circuit board 100 connected to the motor component.

[0034] The hub portion 202 is used to connect with the motor component, and when the motor component is running, it operates synchronously and drives the blade component 204 . When the blade member 204 is in operation, it sucks the air on one side of the fan structure 200 through centrifugal force and other forces, and discharges the sucked air from the other side of the fan structure 200, so as to generate air around the fan structure 200. airflow.

[0035] In addition, the structural shape ...

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Abstract

A fan structure consists of hub, motor set at internal of hub and connected with hub, multiple blades connected to hub and circuit board connected with motor. It features that said circuit board has a projection, the first surface and the second surface, the first surface is opposite to the second surface, heating component in circuit board is set on projection being elongated and projected out off hub.

Description

technical field [0001] The present invention is based on the divisional application submitted on April 15, 2003 with application number 03121862.8. The present invention relates to a fan, in particular to a fan capable of increasing heat dissipation rate and effect. Background technique [0002] The operation mode of the known fan structure is to use the circuit board to drive the motor component, and then drive the hub and fan blades through the motor component to generate an airflow that flows the air on one side to the other side at a certain flow rate. Afterwards, the heat-generating device installed with the fan structure can pass the airflow to remove the heat from the heat-generating device. [0003] However, after the fan has been in operation for a period of time, the heat dissipation effect of the fan will gradually decrease. The main reason for this trend is that the electronic components in the fan will generate heat during operation, and this part of the heat c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K1/02H01L23/36
Inventor 黄跃龙董育龙林侑良黄琛琳
Owner DELTA ELECTRONICS INC