Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire

A technology of iron-nickel alloy and manufacturing method, which is applied in the field of manufacturing iron-nickel alloy-coated oxygen-free copper low-resistance packaging leads, and can solve problems such as poor thermal conductivity, inability to achieve hermetic sealing, and high air leakage rate

Inactive Publication Date: 2009-01-07
赵兵 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But because the thermal conductivity of kovar is very small and poor, its thermal conductivity is only 1 / 23 of copper and 1 / 3.5 of steel, and the price is expensive. 4J29 kovar copper-clad wire composite lead and copper, steel and other substrate materials The coefficient of thermal expansion is severely mismatched, making it impossible to achieve a hermetic seal
Therefore, it is very necessary to develop a high-quality iron-nickel alloy copper-clad lead wire. However, when manufacturing the composite lead wire, iron-nickel alloy 4J50 is generally used to wrap copper, which often causes more voids at the joint between the copper core and the iron-nickel alloy, resulting in air leakage. high rate

Method used

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  • Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire
  • Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire
  • Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire

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Experimental program
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Embodiment Construction

[0013] according to figure 1 As shown, the selected mass ratio is Fe 50 Ni 50 The 4J50 iron-nickel alloy round tube with a diameter of 12mm and a wall thickness of 3mm, and an oxygen-free copper rod with a diameter of 5mm are reversely electrolytically cleaned to get a fresh surface and then dried, and the oxygen-free copper rod is nested into the A coaxial cladding structure is formed in the iron-nickel alloy round tube to obtain a composite billet. Since the diameter of the oxygen-free copper rod embedded is smaller than that of the iron-nickel alloy round tube, a certain gap is left between the two. The physical properties of the selected iron-nickel alloy round tube and oxygen-free copper rod are shown in Table 1.

[0014] Table I:

[0015] Density (g / cm 3 )

Melting point (W / m.K)

Thermal conductivity

(Ω.mm 2 / m)

Resistivity

(Ω.mm 2 / m)

Thermal expansion coefficient

(10 -6 °C)

Elastic Modulus

(Gpa) ...

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Abstract

This invention provides a low-resistant packaging lead wire preparation method of iron-nickel alloy wrapping oxygen-free copper, which comprises steps as following: selecting iron-nickel alloy cylinder pipe and oxygen-free copper bar material with weight rate of Fe50Ni50, cleaning repeatedly to obtain fresh surfaces; embedding the bar material into alloy pipe to obtain complex blank; composing by cold solidification wall and hot solidification wall on reduced atmosphere, cold drawing and obtain product. The invention has firm combination and small resistance.

Description

technical field [0001] The invention relates to a method for manufacturing an iron-nickel alloy-coated oxygen-free copper low-resistance packaging lead. Background technique [0002] With the development of control technology, more and more high-current components are needed in electronic devices, such as high-current solid state relays, high-current DC / DC converters, high-current VDMOS, switching tubes, etc. Usually a metal case is used. Because the metal casing of high-power devices usually adopts copper base, steel sealing frame, or steel base, it is necessary to develop high-current and low-resistance packaging leads, which require low resistance and roughly the same expansion coefficient as the substrate material. In the past, there was only 4J29 Kovar copper-clad wire in China, which was used to make Kovar glass to match Canberra with low-resistance leads. But because the thermal conductivity of kovar is very small and poor, its thermal conductivity is only 1 / 23 of c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P23/04
Inventor 赵兵陈献华陈伟勇
Owner 赵兵
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