Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire
A technology of iron-nickel alloy and manufacturing method, which is applied in the field of manufacturing iron-nickel alloy-coated oxygen-free copper low-resistance packaging leads, and can solve problems such as poor thermal conductivity, inability to achieve hermetic sealing, and high air leakage rate
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[0013] according to figure 1 As shown, the selected mass ratio is Fe 50 Ni 50 The 4J50 iron-nickel alloy round tube with a diameter of 12mm and a wall thickness of 3mm, and an oxygen-free copper rod with a diameter of 5mm are reversely electrolytically cleaned to get a fresh surface and then dried, and the oxygen-free copper rod is nested into the A coaxial cladding structure is formed in the iron-nickel alloy round tube to obtain a composite billet. Since the diameter of the oxygen-free copper rod embedded is smaller than that of the iron-nickel alloy round tube, a certain gap is left between the two. The physical properties of the selected iron-nickel alloy round tube and oxygen-free copper rod are shown in Table 1.
[0014] Table I:
[0015] Density (g / cm 3 )
Melting point (W / m.K)
Thermal conductivity
(Ω.mm 2 / m)
Resistivity
(Ω.mm 2 / m)
Thermal expansion coefficient
(10 -6 °C)
Elastic Modulus
(Gpa) ...
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