Processing equipment assembly

A process equipment and equipment technology, applied in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve the problems of incomplete protection of the copper metal layer, etc., and achieve the effect of flexible process, shortened process time, and more efficient process

Active Publication Date: 2009-03-04
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it can be seen that the method disclosed by Nogami cannot completely protect the copper metal layer from being oxidized

Method used

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  • Processing equipment assembly
  • Processing equipment assembly
  • Processing equipment assembly

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Embodiment Construction

[0029] In order to make the above-mentioned purpose, features and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below and described in detail in conjunction with the accompanying drawings.

[0030] figure 2It is a schematic cross-sectional view of a process equipment group according to an embodiment of the present invention. The process equipment group includes a closed cavity 200 , at least one process chamber 210 (preferably a plurality of them), at least one transport device 220 and one or more valves, such as valves 230 and 240 . A platform 201 , table top or other supporting devices are disposed in the airtight cavity 200 to support the transfer device 220 carrying a substrate 270 and the process chamber 210 . In one embodiment, the transport device 220 moves along a track or guide path 225 provided on the platform 201 .

[0031] The sealed cavity 200 includes a closed space filled with gas. In the embodiment, the close...

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Abstract

The invention provides a cluster treatment device capable of completely protecting a steel layer from oxide formation. The cluster treatment device includes: a casing; at least one treatment chamber; a robot; and at least one of valves. The casing includes gas inside the casing, and has at least one door for putting a lid on the opening of the casing. The gas contains at least one reducing gas. The robot is provided in the casing, and conveys a substrate between the door and the treatment chamber. The valves are connected to the casing.

Description

technical field [0001] The present invention relates to a process equipment, in particular to a semiconductor wafer process equipment group. Background technique [0002] With the advancement of electronic products, semiconductor technology has been widely used in the manufacture of, for example, memories, central processing units, liquid crystal displays, light emitting diodes, laser diodes, and other components or chipsets. To meet the requirements of high integration and speed, the size of semiconductor integrated circuits has been reduced and various materials such as copper and ultra-low dielectric constant are used to overcome the problems related to materials and requirements in manufacturing. [0003] figure 1 It is a schematic cross-sectional view of a conventional via structure. A copper metal layer 110 is formed on a substrate 100 . A low-k dielectric layer 120 is formed on the copper metal layer 110 . A copper via 130 is formed in the low-k dielectric layer 1...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67H01L21/677
Inventor 余振华蔡明兴萧义理
Owner TAIWAN SEMICON MFG CO LTD
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